Fracture toughness (K{sub IC}) data reduction program

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Description

This report documents the development, verification, and use instructions for an automated K{sub IC} data reduction program written in the Hewlett Packard Visual Engineering Environment (HP VEE) programming language. Currently, when the standard test method Plane-Strain Fracture Toughness of Metallic materials (K{sub IC}), is performed, the data is reduced manually. Date reduction includes 15 detailed calculations required by the American Society for Testing and Materials (ASTM) E399 to determine the validity of the computed K{sub IC} value. Manual data reduction is both time consuming, tedious, and prone to errors. Since all K{sub IC} tests are completed using a data acquisition ... continued below

Physical Description

[50] p.

Creation Information

Heiman, M.R. September 1, 1998.

Context

This report is part of the collection entitled: Office of Scientific & Technical Information Technical Reports and was provided by UNT Libraries Government Documents Department to Digital Library, a digital repository hosted by the UNT Libraries. It has been viewed 14 times . More information about this report can be viewed below.

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  • Bettis Atomic Power Laboratory
    Publisher Info: Bettis Atomic Power Lab., West Mifflin, PA (United States)
    Place of Publication: West Mifflin, Pennsylvania

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Description

This report documents the development, verification, and use instructions for an automated K{sub IC} data reduction program written in the Hewlett Packard Visual Engineering Environment (HP VEE) programming language. Currently, when the standard test method Plane-Strain Fracture Toughness of Metallic materials (K{sub IC}), is performed, the data is reduced manually. Date reduction includes 15 detailed calculations required by the American Society for Testing and Materials (ASTM) E399 to determine the validity of the computed K{sub IC} value. Manual data reduction is both time consuming, tedious, and prone to errors. Since all K{sub IC} tests are completed using a data acquisition system to digitally record time, load, and crack opening displacement (COD); automation of K{sub IC} data reduction using a computer program to perform all calculations rapidly, enables processing of a large amount of data. The K{sub IC} data reduction program reduces any computer American Standard Code for Information Interchange (ASCII) data file. Thus, the K{sub IC} data reduction program is also used to over check tests performed at other facilities. The program was qualified based on mechanical properties of commercial alloy specimens.

Physical Description

[50] p.

Notes

OSTI as DE98006083

Source

  • Other Information: PBD: [1998]

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  • Other: DE98006083
  • Report No.: WAPD-T--3194
  • Grant Number: AC11-93PN38195
  • DOI: 10.2172/663569 | External Link
  • Office of Scientific & Technical Information Report Number: 663569
  • Archival Resource Key: ark:/67531/metadc706270

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Creation Date

  • September 1, 1998

Added to The UNT Digital Library

  • Sept. 12, 2015, 6:31 a.m.

Description Last Updated

  • Nov. 20, 2015, 7:56 p.m.

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Heiman, M.R. Fracture toughness (K{sub IC}) data reduction program, report, September 1, 1998; West Mifflin, Pennsylvania. (digital.library.unt.edu/ark:/67531/metadc706270/: accessed August 19, 2017), University of North Texas Libraries, Digital Library, digital.library.unt.edu; crediting UNT Libraries Government Documents Department.