Uncooled Thin Film Infrared Imaging Device With Aerogel Thermal Isolation: Deposition and Planarization Techniques

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The authors have successfully integrated a thermally insulating silica aerogel thin film into a new uncooled monolithic thin film infrared (IR) imaging device. Compared to other technologies (bulk ceramic and microbridge), use of an aerogel layer provides superior thermal isolation of the pyroelectric imaging element from the relatively massive heat sinking integrated circuit. This results in significantly higher thermal and temporal resolutions. They have calculated noise equivalent temperature differences of 0.04--0.10 C from a variety of Pb{sub x}Zr{sub y}Ti{sub 1{minus}y}O{sub 3} (PZT) and Pb{sub x}La{sub 1{minus}x}Zr{sub y}Ti{sub 1{minus}y}O{sub 3} (PLZT) pyroelectric imaging elements in monolithic structures. In addition, use of … continued below

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Ruffner, J. A.; Clem, P. G.; Tuttle, B. A.; Brinker, C. J.; Sriram, C. S. & Bullington, J. A. April 1, 1998.

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  • Sandia National Laboratories
    Publisher Info: Sandia National Labs., Albuquerque, NM (United States)
    Place of Publication: Albuquerque, New Mexico

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The authors have successfully integrated a thermally insulating silica aerogel thin film into a new uncooled monolithic thin film infrared (IR) imaging device. Compared to other technologies (bulk ceramic and microbridge), use of an aerogel layer provides superior thermal isolation of the pyroelectric imaging element from the relatively massive heat sinking integrated circuit. This results in significantly higher thermal and temporal resolutions. They have calculated noise equivalent temperature differences of 0.04--0.10 C from a variety of Pb{sub x}Zr{sub y}Ti{sub 1{minus}y}O{sub 3} (PZT) and Pb{sub x}La{sub 1{minus}x}Zr{sub y}Ti{sub 1{minus}y}O{sub 3} (PLZT) pyroelectric imaging elements in monolithic structures. In addition, use of aerogels results in an easier, less expensive fabrication process and a more robust device. Fabrication of these monolithic devices entails sol-gel deposition of the aerogel, sputter deposition of the electrodes, and solution chemistry deposition of the pyroelectric imaging elements. Uniform pyroelectric response is achieved across the device by use of appropriate planarization techniques. These deposition and planarization techniques are described. Characterization of the individual layers and monolithic structure using scanning electron microscopy, atomic force microscopy and Byer-Roundy techniques also is discussed.

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20 p.

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OSTI as DE98004623

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  • American Vacum Society conference on thin solid films (TSF) and surface and coatings technology (SCT), San Diego, CA (United States), 27 Apr - 1 May 1998

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  • April 1, 1998

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Ruffner, J. A.; Clem, P. G.; Tuttle, B. A.; Brinker, C. J.; Sriram, C. S. & Bullington, J. A. Uncooled Thin Film Infrared Imaging Device With Aerogel Thermal Isolation: Deposition and Planarization Techniques, article, April 1, 1998; Albuquerque, New Mexico. (https://digital.library.unt.edu/ark:/67531/metadc706202/: accessed April 18, 2024), University of North Texas Libraries, UNT Digital Library, https://digital.library.unt.edu; crediting UNT Libraries Government Documents Department.

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