Predicting Microstructural-Level Residual Stresses and Crack Paths in Ceramics

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Description

Microstructural-level residual stresses arise in ceramics due to thermal expansion anisotropy. The magnitude of these stresses can be very high and may cause spontaneous microcracking during the processing of these materials. The orientation data obtained by backscattered electron diffraction and grain boundary energies obtained by AFM were used in conjunction with an object oriented finite element analysis package (OOF) to predict the magnitude of residual stresses in alumina. Crack initiation and propagation were also simulated based on the Griffith fracture criterion.

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7 Pages

Creation Information

Cater, W.C.; Glass, S.J.; Rohrer, G.S.; Saylor, D.M. & Vedula, V.R. May 19, 1999.

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  • Sandia National Laboratories
    Publisher Info: Sandia National Laboratories (SNL), Albuquerque, NM, and Livermore, CA
    Place of Publication: Albuquerque, New Mexico

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Description

Microstructural-level residual stresses arise in ceramics due to thermal expansion anisotropy. The magnitude of these stresses can be very high and may cause spontaneous microcracking during the processing of these materials. The orientation data obtained by backscattered electron diffraction and grain boundary energies obtained by AFM were used in conjunction with an object oriented finite element analysis package (OOF) to predict the magnitude of residual stresses in alumina. Crack initiation and propagation were also simulated based on the Griffith fracture criterion.

Physical Description

7 Pages

Source

  • Twelfth International Conference on Textures of Materials; Montreal, Canada; 08/09-13/1999

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  • Other: DE00007262
  • Report No.: SAND99-1276C
  • Grant Number: AC04-94AL85000
  • Office of Scientific & Technical Information Report Number: 7262
  • Archival Resource Key: ark:/67531/metadc704335

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Office of Scientific & Technical Information Technical Reports

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Creation Date

  • May 19, 1999

Added to The UNT Digital Library

  • Sept. 12, 2015, 6:31 a.m.

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  • Dec. 6, 2016, 4:16 p.m.

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Cater, W.C.; Glass, S.J.; Rohrer, G.S.; Saylor, D.M. & Vedula, V.R. Predicting Microstructural-Level Residual Stresses and Crack Paths in Ceramics, article, May 19, 1999; Albuquerque, New Mexico. (digital.library.unt.edu/ark:/67531/metadc704335/: accessed November 17, 2017), University of North Texas Libraries, Digital Library, digital.library.unt.edu; crediting UNT Libraries Government Documents Department.