Flip Chip Attach (TRP ARPA No. 3327). Quarterly report, January 1, 1995--March 31, 1995

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Description

IBM Endicott, Assembly Process Design has continued to progress on the ARPA Contract for Conductive Adhesive Flip Chip Attach during the period January 3, 1995 to March 31, 1995 in defining process bonding parameters. An initial test chip design has been defined and ordered. Insights have been gained about stencil printing. Benchmarking reliability tests of flip chip encapsulants continued as well as studies on the thermal conductivity of the electrically conductive adhesive.

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15 p.

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Woychik, C.G. June 1, 1995.

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Description

IBM Endicott, Assembly Process Design has continued to progress on the ARPA Contract for Conductive Adhesive Flip Chip Attach during the period January 3, 1995 to March 31, 1995 in defining process bonding parameters. An initial test chip design has been defined and ordered. Insights have been gained about stencil printing. Benchmarking reliability tests of flip chip encapsulants continued as well as studies on the thermal conductivity of the electrically conductive adhesive.

Physical Description

15 p.

Notes

OSTI as DE95012189

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  • Other Information: PBD: [1995]

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  • Other: DE95012189
  • Report No.: DOE/AL/98817--2
  • Grant Number: FC04-94AL98817
  • DOI: 10.2172/70726 | External Link
  • Office of Scientific & Technical Information Report Number: 70726
  • Archival Resource Key: ark:/67531/metadc704252

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  • June 1, 1995

Added to The UNT Digital Library

  • Sept. 12, 2015, 6:31 a.m.

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  • Dec. 11, 2015, 4:41 p.m.

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Woychik, C.G. Flip Chip Attach (TRP ARPA No. 3327). Quarterly report, January 1, 1995--March 31, 1995, report, June 1, 1995; United States. (digital.library.unt.edu/ark:/67531/metadc704252/: accessed September 26, 2017), University of North Texas Libraries, Digital Library, digital.library.unt.edu; crediting UNT Libraries Government Documents Department.