Carbon dioxide-based supercritical fluids as IC manufacturing solvents

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The production of integrated circuits (IC's) involves a number of discrete steps which utilize hazardous or regulated solvents and generate large waste streams. ES&H considerations associated with these chemicals have prompted a search for alternative, more environmentally benign solvent systems. An emerging technology for conventional solvent replacement is the use of supercritical fluids based on carbon dioxide (CO{sub 2}). Research work, conducted at Los Alamos in conjunction with the Hewlett-Packard Company, has lead to the development of a CO{sub 2}-based supercritical fluid treatment system for the stripping of hard-baked photoresists. This treatment system, known as Supercritical CO{sub 2} Resist Remover, ... continued below

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9 p.

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Rubin, J.B.; Davenhall, L.B.; Taylor, C.M.V.; Sivils, L.D.; Pierce, T. & Tiefert, K. May 11, 1999.

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  • Los Alamos National Laboratory
    Publisher Info: Los Alamos National Lab., Los Alamos, NM (United States)
    Place of Publication: Los Alamos, New Mexico

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The production of integrated circuits (IC's) involves a number of discrete steps which utilize hazardous or regulated solvents and generate large waste streams. ES&H considerations associated with these chemicals have prompted a search for alternative, more environmentally benign solvent systems. An emerging technology for conventional solvent replacement is the use of supercritical fluids based on carbon dioxide (CO{sub 2}). Research work, conducted at Los Alamos in conjunction with the Hewlett-Packard Company, has lead to the development of a CO{sub 2}-based supercritical fluid treatment system for the stripping of hard-baked photoresists. This treatment system, known as Supercritical CO{sub 2} Resist Remover, or CORR, uses a two-component solvent composed of a nonhazardous, non-regulated compound, dissolved in supercritical CO{sub 2}. The solvent/treatment system has been successfully tested on metallized Si wafers coated with negative and positive photoresist, the latter both before and after ion-implantation. A description of the experimental data will be presented. Based on the initial laboratory results, the project has progressed to the design and construction of prototype, single-wafer photoresist-stripping equipment. The integrated system involves a closed-loop, recirculating cycle which continuously cleans and regenerates the CO{sub 2}, recycles the dissolved solvent, and separates and concentrates the spent resist. The status of the current design and implementation strategy of a treatment system to existing IC fabrication facilities will be discussed. Additional remarks will be made on the use of a SCORR-type system for the cleaning of wafers prior to processing.

Physical Description

9 p.

Notes

OSTI as DE00756937

Medium: P; Size: 9 pages

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  • 1999 IEEE International Symposium on Electronics and the Environment, Danvers, MA (US), 05/11/1999--05/13/1999

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  • Report No.: LA-UR-99-831
  • Grant Number: W-7405-ENG-36
  • Office of Scientific & Technical Information Report Number: 756937
  • Archival Resource Key: ark:/67531/metadc703730

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  • May 11, 1999

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  • Sept. 12, 2015, 6:31 a.m.

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  • April 11, 2017, 7:31 p.m.

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Rubin, J.B.; Davenhall, L.B.; Taylor, C.M.V.; Sivils, L.D.; Pierce, T. & Tiefert, K. Carbon dioxide-based supercritical fluids as IC manufacturing solvents, article, May 11, 1999; Los Alamos, New Mexico. (digital.library.unt.edu/ark:/67531/metadc703730/: accessed October 18, 2018), University of North Texas Libraries, Digital Library, digital.library.unt.edu; crediting UNT Libraries Government Documents Department.