Twenty years of service at NBNM - Analysis of Spectrolab module

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This study of adhesional strength and surface analysis of encapsulant and silicon cell samples from a Natural Bridges National Monument (NBNM) Spectrolab module is an attempt to understand from its success. The module was fabricated using polyvinyl butyral (PVB) as an encapsulant. The average adhesional shear strength of the encapsulant at the cell/encapsulant interface in this module was 4.51 MPa or {approximately} 18% lower than that in currently manufactured modules. Typical encapsulant surface composition was as follows: C 75.0 at.% O 23.2 at.%, and Si 1.6 at.%, with Ag {approximately}0.2 at.% and Pb {approximately} 0.5 at.% with some tin respectively ... continued below

Physical Description

2 p.

Creation Information

DHERE,N.G.; PANDIT,M.B.; GHONGADI,S.R.; QUINTANA,MICHAEL A.; KING,DAVID L. & KRATOCHVIL,JAY A. April 11, 2000.

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This article is part of the collection entitled: Office of Scientific & Technical Information Technical Reports and was provided by UNT Libraries Government Documents Department to Digital Library, a digital repository hosted by the UNT Libraries. It has been viewed 13 times . More information about this article can be viewed below.

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  • Sandia National Laboratories
    Publisher Info: Sandia National Labs., Albuquerque, NM, and Livermore, CA (United States)
    Place of Publication: Albuquerque, New Mexico

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Description

This study of adhesional strength and surface analysis of encapsulant and silicon cell samples from a Natural Bridges National Monument (NBNM) Spectrolab module is an attempt to understand from its success. The module was fabricated using polyvinyl butyral (PVB) as an encapsulant. The average adhesional shear strength of the encapsulant at the cell/encapsulant interface in this module was 4.51 MPa or {approximately} 18% lower than that in currently manufactured modules. Typical encapsulant surface composition was as follows: C 75.0 at.% O 23.2 at.%, and Si 1.6 at.%, with Ag {approximately}0.2 at.% and Pb {approximately} 0.5 at.% with some tin respectively over the grid lines and solder bond. Representative silicon cell surface composition was: K 1.4 at.%, C 20.8 at.%, Sn 0.94 at.%, O 15.1 at.%, Na 2.7 at.% and Si 59.0 at.%. The presence of tin detected on the silicon cell surface may be attributed to corrosion of solder bond. The module differs from typical contemporary modules in the use of PVB, metallic mesh type interconnection, and silicon oxide AR coating.

Physical Description

2 p.

Notes

OSTI as DE00755636

Medium: P; Size: 2 pages

Source

  • National Center for Photovoltaics Program Review, Denver, CO (US), 04/17/2000--04/19/2000

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  • Report No.: SAND2000-0905C
  • Grant Number: AC04-94AL85000
  • Office of Scientific & Technical Information Report Number: 755636
  • Archival Resource Key: ark:/67531/metadc703524

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  • April 11, 2000

Added to The UNT Digital Library

  • Sept. 12, 2015, 6:31 a.m.

Description Last Updated

  • April 10, 2017, 3:04 p.m.

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DHERE,N.G.; PANDIT,M.B.; GHONGADI,S.R.; QUINTANA,MICHAEL A.; KING,DAVID L. & KRATOCHVIL,JAY A. Twenty years of service at NBNM - Analysis of Spectrolab module, article, April 11, 2000; Albuquerque, New Mexico. (digital.library.unt.edu/ark:/67531/metadc703524/: accessed September 21, 2017), University of North Texas Libraries, Digital Library, digital.library.unt.edu; crediting UNT Libraries Government Documents Department.