Optical fabrication and metrology for a visible through thermal infrared multi-band imaging system Page: 3 of 11
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location. This design reduces the thermal background from the surrounding telescope structure by allowing for
100% cold shielding.
The linear arrays on the FPA are arranged in three pairs of sensor chip assemblies (SCAs). Each pair of SCAs
consist of a visible wavelength to mid-wavelength infrared SCA and a long wavelength infrared SCA. The
arrangement of the SCAs on the focal plane is shown in Figure 1. Three pairs of SCAs are used to span the full
cross-track field of view. Bands A-D are the visible (VIS) bands whose spectral bandpasses are in the wavelength
range of 0.45 - 0.86 microns. Bands E-G are near-infrared (NIR) bands whose spectral bandpasses are in the
wavelength range of 0.86 - 1.04 microns. Bands H, I, and O are the short wavelength infrared (SWIR) bands whose
spectral bandpasses are in the wavelength range of 1.36 - 2.35 microns. Bands J-K are medium wavelength infrared
(MWIR) bands whose spectral bandpasses are in the wavelength range of 3.50 - 5.07 microns. Bands L-N are long
wavelength infrared (LWIR) bands whose spectral bandpasses are in the wavelength range of 8.00 - 10.7 microns.
Silicon photodiodes are used for bands A-D. Indium antimonide is used for bands E-K and O. Mercury cadmium
telluride is used for bands L-N.
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Magner, J. & Henson, T. Optical fabrication and metrology for a visible through thermal infrared multi-band imaging system, article, April 1, 1998; Albuquerque, New Mexico. (digital.library.unt.edu/ark:/67531/metadc701986/m1/3/: accessed October 21, 2018), University of North Texas Libraries, Digital Library, digital.library.unt.edu; crediting UNT Libraries Government Documents Department.