High reliability plastic packaging for microelectronics

PDF Version Also Available for Download.

Description

Goal was Assembly Test Chips (ATCs) which could be used for evaluating plastic encapsulation technologies. Circuits were demonstrated for measuring Au-Al wirebond and Al metal corrosion failure rates during accelerated temperature and humidity testing. The test circuits on the ATC02.5 chip were very sensitive to extrinsic or processing induced failure rates. Accelerated aging experiments were conducted with unpassivated triple track Al structures on the ATC02.6 chip; the unpassivated tracks were found to be very sensitive to particulate contamination. Some modifications to existing circuitry were suggested. The piezoresistive stress sensing circuitry designed for the ATC04 test chip was found suitable for ... continued below

Physical Description

39 p.

Creation Information

Sweet, J.N.; Peterson, D.W.; Hsia, A.H. & Tuck, M. July 1, 1997.

Context

This report is part of the collection entitled: Office of Scientific & Technical Information Technical Reports and was provided by UNT Libraries Government Documents Department to Digital Library, a digital repository hosted by the UNT Libraries. More information about this report can be viewed below.

Who

People and organizations associated with either the creation of this report or its content.

Sponsor

Publisher

  • Sandia National Laboratories
    Publisher Info: Sandia National Labs., Albuquerque, NM (United States)
    Place of Publication: Albuquerque, New Mexico

Provided By

UNT Libraries Government Documents Department

Serving as both a federal and a state depository library, the UNT Libraries Government Documents Department maintains millions of items in a variety of formats. The department is a member of the FDLP Content Partnerships Program and an Affiliated Archive of the National Archives.

Contact Us

What

Descriptive information to help identify this report. Follow the links below to find similar items on the Digital Library.

Description

Goal was Assembly Test Chips (ATCs) which could be used for evaluating plastic encapsulation technologies. Circuits were demonstrated for measuring Au-Al wirebond and Al metal corrosion failure rates during accelerated temperature and humidity testing. The test circuits on the ATC02.5 chip were very sensitive to extrinsic or processing induced failure rates. Accelerated aging experiments were conducted with unpassivated triple track Al structures on the ATC02.6 chip; the unpassivated tracks were found to be very sensitive to particulate contamination. Some modifications to existing circuitry were suggested. The piezoresistive stress sensing circuitry designed for the ATC04 test chip was found suitable for determining the change in the state of mechanical stress at the die when both initial and final measurements were made near room temperature (RT). Attempt to measure thermal stress between RT and a typical polymer glass transition temperature failed because of excessive die resistor- substrate leakage currents at the high temperature end; suitable circuitry changes were developed to overcome this problem. One temperature and humidity experiment was conducted with Sandia developed static radom access memory parts to examine non-corrosion CMOS failures; this objective was not achieved, but corrosion failure at the metal to Si contacts on the die surface could be detected. This 2-year effort resulted in new designs for test circuits which could be used on an advanced ATC for reliability assessment in Defense Programs electronics development projects.

Physical Description

39 p.

Notes

OSTI as DE97008786

Source

  • Other Information: PBD: Jul 1997

Language

Item Type

Identifier

Unique identifying numbers for this report in the Digital Library or other systems.

  • Other: DE97008786
  • Report No.: SAND--97-1721
  • Grant Number: AC04-94AL85000
  • DOI: 10.2172/520618 | External Link
  • Office of Scientific & Technical Information Report Number: 520618
  • Archival Resource Key: ark:/67531/metadc697978

Collections

This report is part of the following collection of related materials.

Office of Scientific & Technical Information Technical Reports

Reports, articles and other documents harvested from the Office of Scientific and Technical Information.

Office of Scientific and Technical Information (OSTI) is the Department of Energy (DOE) office that collects, preserves, and disseminates DOE-sponsored research and development (R&D) results that are the outcomes of R&D projects or other funded activities at DOE labs and facilities nationwide and grantees at universities and other institutions.

What responsibilities do I have when using this report?

When

Dates and time periods associated with this report.

Creation Date

  • July 1, 1997

Added to The UNT Digital Library

  • Aug. 14, 2015, 8:43 a.m.

Description Last Updated

  • May 5, 2016, 8:30 p.m.

Usage Statistics

When was this report last used?

Yesterday: 0
Past 30 days: 0
Total Uses: 5

Interact With This Report

Here are some suggestions for what to do next.

Start Reading

PDF Version Also Available for Download.

Citations, Rights, Re-Use

Sweet, J.N.; Peterson, D.W.; Hsia, A.H. & Tuck, M. High reliability plastic packaging for microelectronics, report, July 1, 1997; Albuquerque, New Mexico. (digital.library.unt.edu/ark:/67531/metadc697978/: accessed October 17, 2017), University of North Texas Libraries, Digital Library, digital.library.unt.edu; crediting UNT Libraries Government Documents Department.