Coarsening of the Sn-Pb Solder Microstructure in Constitutive Model-Based Predictions of Solder Joint Thermal Mechanical Fatigue

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Description

Thermal mechanical fatigue (TMF) is an important damage mechanism for solder joints exposed to cyclic temperature environments. Predicting the service reliability of solder joints exposed to such conditions requires two knowledge bases: first, the extent of fatigue damage incurred by the solder microstructure leading up to fatigue crack initiation, must be quantified in both time and space domains. Secondly, fatigue crack initiation and growth must be predicted since this metric determines, explicitly, the loss of solder joint functionality as it pertains to its mechanical fastening as well as electrical continuity roles. This paper will describe recent progress in a research ... continued below

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22 p.

Creation Information

Vianco, P.T.; Burchett, S.N.; Neilsen, M.K.; Rejent, J.A. & Frear, D.R. April 12, 1999.

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This article is part of the collection entitled: Office of Scientific & Technical Information Technical Reports and was provided by UNT Libraries Government Documents Department to Digital Library, a digital repository hosted by the UNT Libraries. More information about this article can be viewed below.

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  • Sandia National Laboratories
    Publisher Info: Sandia National Labs., Albuquerque, NM, and Livermore, CA
    Place of Publication: Albuquerque, New Mexico

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Description

Thermal mechanical fatigue (TMF) is an important damage mechanism for solder joints exposed to cyclic temperature environments. Predicting the service reliability of solder joints exposed to such conditions requires two knowledge bases: first, the extent of fatigue damage incurred by the solder microstructure leading up to fatigue crack initiation, must be quantified in both time and space domains. Secondly, fatigue crack initiation and growth must be predicted since this metric determines, explicitly, the loss of solder joint functionality as it pertains to its mechanical fastening as well as electrical continuity roles. This paper will describe recent progress in a research effort to establish a microstructurally-based, constitutive model that predicts TMF deformation to 63Sn-37Pb solder in electronic solder joints up to the crack initiation step. The model is implemented using a finite element setting; therefore, the effects of both global and local thermal expansion mismatch conditions in the joint that would arise from temperature cycling.

Physical Description

22 p.

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OSTI as DE00005803

Medium: P; Size: 22 pages

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  • Journal Name: Journal of Electronic Materials; Other Information: Submitted to Journal of Electronic Materials

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  • Report No.: SAND99-0932J
  • Grant Number: AC04-94AL85000
  • Office of Scientific & Technical Information Report Number: 5803
  • Archival Resource Key: ark:/67531/metadc697005

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  • April 12, 1999

Added to The UNT Digital Library

  • Aug. 14, 2015, 8:43 a.m.

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  • April 10, 2017, 3:14 p.m.

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Vianco, P.T.; Burchett, S.N.; Neilsen, M.K.; Rejent, J.A. & Frear, D.R. Coarsening of the Sn-Pb Solder Microstructure in Constitutive Model-Based Predictions of Solder Joint Thermal Mechanical Fatigue, article, April 12, 1999; Albuquerque, New Mexico. (digital.library.unt.edu/ark:/67531/metadc697005/: accessed September 23, 2017), University of North Texas Libraries, Digital Library, digital.library.unt.edu; crediting UNT Libraries Government Documents Department.