Development of a hybrid microcircuit test vehicle for surface mount applications

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Description

The technology drivers of the electronics industry continue to be systems miniaturization and reliability, in addition to addressing a variety of important environmental concerns. Surface mount technology (SMT) has evolved in response to these issues. Prototype hybrid test vehicles have been developed at Sandia National Laboratories to evaluate three lead-free solders for Au-Pt-Pd thick film soldering. The alloys are based on the Sn-Ag, Sn-Ag-Bi and Sn-Ag-Bi-Au systems. Populated test vehicles with surface mount devices were designed and fabricated to evaluate actual solder joints. Pastes were screen printed on the test substrates and reflowed with the components in place. The test ... continued below

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6 p.

Creation Information

Hernandez, C.L.; Hosking, F.M. & Vianco, P.T. August 1, 1997.

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This article is part of the collection entitled: Office of Scientific & Technical Information Technical Reports and was provided by UNT Libraries Government Documents Department to Digital Library, a digital repository hosted by the UNT Libraries. More information about this article can be viewed below.

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  • Sandia National Laboratories
    Publisher Info: Sandia National Labs., Albuquerque, NM (United States)
    Place of Publication: Albuquerque, New Mexico

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Description

The technology drivers of the electronics industry continue to be systems miniaturization and reliability, in addition to addressing a variety of important environmental concerns. Surface mount technology (SMT) has evolved in response to these issues. Prototype hybrid test vehicles have been developed at Sandia National Laboratories to evaluate three lead-free solders for Au-Pt-Pd thick film soldering. The alloys are based on the Sn-Ag, Sn-Ag-Bi and Sn-Ag-Bi-Au systems. Populated test vehicles with surface mount devices were designed and fabricated to evaluate actual solder joints. Pastes were screen printed on the test substrates and reflowed with the components in place. The test components consist of a variety of dummy chip capacitors and leadless ceramic chip carriers (LCC`s). The development of the reflow profiles will be discussed. Comprehensive defect analysis will also be presented.

Physical Description

6 p.

Notes

OSTI as DE97007794

Source

  • 30. international symposium on microelectronics, Philadelphia, PA (United States), 12-16 Oct 1997

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  • Other: DE97007794
  • Report No.: SAND--97-0553C
  • Report No.: CONF-971028--1
  • Grant Number: AC04-94AL85000
  • Office of Scientific & Technical Information Report Number: 527902
  • Archival Resource Key: ark:/67531/metadc696338

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Office of Scientific & Technical Information Technical Reports

Reports, articles and other documents harvested from the Office of Scientific and Technical Information.

Office of Scientific and Technical Information (OSTI) is the Department of Energy (DOE) office that collects, preserves, and disseminates DOE-sponsored research and development (R&D) results that are the outcomes of R&D projects or other funded activities at DOE labs and facilities nationwide and grantees at universities and other institutions.

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Creation Date

  • August 1, 1997

Added to The UNT Digital Library

  • Aug. 14, 2015, 8:43 a.m.

Description Last Updated

  • April 14, 2016, 3:32 p.m.

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Hernandez, C.L.; Hosking, F.M. & Vianco, P.T. Development of a hybrid microcircuit test vehicle for surface mount applications, article, August 1, 1997; Albuquerque, New Mexico. (digital.library.unt.edu/ark:/67531/metadc696338/: accessed December 13, 2017), University of North Texas Libraries, Digital Library, digital.library.unt.edu; crediting UNT Libraries Government Documents Department.