W88 integrated circuit shelf life program

PDF Version Also Available for Download.

Description

The W88 Integrated Circuit Shelf Life Program was created to monitor the long term performance, reliability characteristics, and technological status of representative WR ICs manufactured by the Allied Signal Albuquerque Microelectronics Operation (AMO) and by Harris Semiconductor Custom Integrated Circuits Division. Six types of ICs were used. A total of 272 ICs entered two storage temperature environments. Electrical testing and destructive physical analysis were completed in 1995. During each year of the program, the ICs were electrically tested and samples were selected for destructive physical analysis (DPA). ICs that failed electrical tests or DPA criteria were analyzed. Fifteen electrical failures ... continued below

Physical Description

27 p.

Creation Information

Soden, J.M. & Anderson, R.E. January 1, 1998.

Context

This report is part of the collection entitled: Office of Scientific & Technical Information Technical Reports and was provided by UNT Libraries Government Documents Department to Digital Library, a digital repository hosted by the UNT Libraries. It has been viewed 14 times . More information about this report can be viewed below.

Who

People and organizations associated with either the creation of this report or its content.

Sponsor

Publisher

  • Sandia National Laboratories
    Publisher Info: Sandia National Labs., Albuquerque, NM (United States)
    Place of Publication: Albuquerque, New Mexico

Provided By

UNT Libraries Government Documents Department

Serving as both a federal and a state depository library, the UNT Libraries Government Documents Department maintains millions of items in a variety of formats. The department is a member of the FDLP Content Partnerships Program and an Affiliated Archive of the National Archives.

Contact Us

What

Descriptive information to help identify this report. Follow the links below to find similar items on the Digital Library.

Description

The W88 Integrated Circuit Shelf Life Program was created to monitor the long term performance, reliability characteristics, and technological status of representative WR ICs manufactured by the Allied Signal Albuquerque Microelectronics Operation (AMO) and by Harris Semiconductor Custom Integrated Circuits Division. Six types of ICs were used. A total of 272 ICs entered two storage temperature environments. Electrical testing and destructive physical analysis were completed in 1995. During each year of the program, the ICs were electrically tested and samples were selected for destructive physical analysis (DPA). ICs that failed electrical tests or DPA criteria were analyzed. Fifteen electrical failures occurred, with two dominant failure modes: electrical overstress (EOS) damage involving the production test programs and electrostatic discharge (ESD) damage during analysis. Because of the extensive handling required during multi-year programs like this, it is not unusual for EOS and ESD failures to occur even though handling and testing precautions are taken. The clustering of the electrical test failures in a small subset of the test operations supports the conclusion that the test operation itself was responsible for many of the failures and is suspected to be responsible for the others. Analysis of the electrical data for the good ICs found no significant degradation trends caused by the storage environments. Forty-six ICs were selected for DPA with findings primarily in two areas: wire bonding and die processing. The wire bonding and die processing findings are not surprising since these technology conditions had been documented during manufacturing and were determined to present acceptable risk. The current reliability assessment of the W88 stockpile assemblies employing these and related ICs is reinforced by the results of this shelf life program. Data from this program will aid future investigation of 4/3 micron or MNOS IC technology failure modes.

Physical Description

27 p.

Notes

OSTI as DE98002696

Source

  • Other Information: PBD: Jan 1998

Language

Item Type

Identifier

Unique identifying numbers for this report in the Digital Library or other systems.

  • Other: DE98002696
  • Report No.: SAND--98-0029
  • Grant Number: AC04-94AL85000
  • DOI: 10.2172/565606 | External Link
  • Office of Scientific & Technical Information Report Number: 565606
  • Archival Resource Key: ark:/67531/metadc696117

Collections

This report is part of the following collection of related materials.

Office of Scientific & Technical Information Technical Reports

Reports, articles and other documents harvested from the Office of Scientific and Technical Information.

Office of Scientific and Technical Information (OSTI) is the Department of Energy (DOE) office that collects, preserves, and disseminates DOE-sponsored research and development (R&D) results that are the outcomes of R&D projects or other funded activities at DOE labs and facilities nationwide and grantees at universities and other institutions.

What responsibilities do I have when using this report?

When

Dates and time periods associated with this report.

Creation Date

  • January 1, 1998

Added to The UNT Digital Library

  • Aug. 14, 2015, 8:43 a.m.

Description Last Updated

  • April 14, 2016, 2:18 p.m.

Usage Statistics

When was this report last used?

Yesterday: 0
Past 30 days: 1
Total Uses: 14

Interact With This Report

Here are some suggestions for what to do next.

Start Reading

PDF Version Also Available for Download.

Citations, Rights, Re-Use

Soden, J.M. & Anderson, R.E. W88 integrated circuit shelf life program, report, January 1, 1998; Albuquerque, New Mexico. (digital.library.unt.edu/ark:/67531/metadc696117/: accessed November 23, 2017), University of North Texas Libraries, Digital Library, digital.library.unt.edu; crediting UNT Libraries Government Documents Department.