Cost effectiveness of Silent Discharge Plasma for point-of-use VOC emissions control in semiconductor fabrication

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Extensive research into the treatment and control of Volatile Organic Compounds (VOCs) from semiconductor industry manufacturing processes has identified the need for alternatives to existing combustion devices. Specifically, semiconductor manufacturing design is moving toward exploiting effective, small-scale, abatement control technologies for specific point-of-use (POU) waste streams associated with a particular component or manufacturing tool. The Silent Discharge Plasma (SDP) developed at Los Alamos National Laboratory is a nonthermal plasma technology created by a dielectric-ballasted electrical discharge. Influent gas-phase pollutants are destroyed in the reactor by the free radicals or electrons generated by the plasma. This paper examines the potential for ... continued below

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12 p.

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Cummings, M. & Coogan, J. July 1, 1997.

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Extensive research into the treatment and control of Volatile Organic Compounds (VOCs) from semiconductor industry manufacturing processes has identified the need for alternatives to existing combustion devices. Specifically, semiconductor manufacturing design is moving toward exploiting effective, small-scale, abatement control technologies for specific point-of-use (POU) waste streams associated with a particular component or manufacturing tool. The Silent Discharge Plasma (SDP) developed at Los Alamos National Laboratory is a nonthermal plasma technology created by a dielectric-ballasted electrical discharge. Influent gas-phase pollutants are destroyed in the reactor by the free radicals or electrons generated by the plasma. This paper examines the potential for SDP to be used in niche circumstances for POU control of VOC exhaust streams specific to the semiconductor industry. A sensitivity analysis is presented, showing how SDP cost of ownership is affected by changes in the major operational parameters of exhaust flow rate, target compound, destruction removal efficiency (DRE), and electrical duty cycle. The results of cost analysis show that SDP performance and cost effectiveness are flow rate- and compound-specific. The authors conclude that the Silent Discharge Plasma is a viable, cost effective technology under high-concentration, low-flow rate regimes, and for target compounds that have been empirically shown to be conducive to destruction via free radical chemistry.

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12 p.

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OSTI as DE97008342

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  • Institute of Chemical Engineers controlling industrial emissions conference, London (United Kingdom), Nov 1997

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  • Other: DE97008342
  • Report No.: LA-UR--97-1971
  • Report No.: CONF-971155--
  • Grant Number: W-7405-ENG-36
  • Office of Scientific & Technical Information Report Number: 634153
  • Archival Resource Key: ark:/67531/metadc695703

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  • July 1, 1997

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  • Aug. 14, 2015, 8:43 a.m.

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  • May 23, 2016, 2:06 p.m.

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Cummings, M. & Coogan, J. Cost effectiveness of Silent Discharge Plasma for point-of-use VOC emissions control in semiconductor fabrication, article, July 1, 1997; New Mexico. (digital.library.unt.edu/ark:/67531/metadc695703/: accessed June 18, 2018), University of North Texas Libraries, Digital Library, digital.library.unt.edu; crediting UNT Libraries Government Documents Department.