Solder joint aging characteristics from the MC2918 firing set of a B61 accelerated aging unit (AAU)

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The B61 accelerated aging unit (AAU) provided a unique opportunity to document the effects of a controlled, long-term thermal cycling environment on the aging of materials used in the device. This experiment was of particular interest to solder technologists because thermal cycling environments are a predominant source of solder joint failures in electronic assemblies. Observations of through hole solder joints in the MC2918 Firing Set from the B61 AAU did not reveal signs of catastrophic failure. Quantitative analyses of the microstructural metrics of intermetallic compound layer thickness and Pb-rich phase particle distributions indicated solder joint aging that was commensurate with ... continued below

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4 p.

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Vianco, P.T. & Rejent, J.A. October 1, 1997.

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  • Sandia National Laboratories
    Publisher Info: Sandia National Labs., Albuquerque, NM (United States)
    Place of Publication: Albuquerque, New Mexico

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Description

The B61 accelerated aging unit (AAU) provided a unique opportunity to document the effects of a controlled, long-term thermal cycling environment on the aging of materials used in the device. This experiment was of particular interest to solder technologists because thermal cycling environments are a predominant source of solder joint failures in electronic assemblies. Observations of through hole solder joints in the MC2918 Firing Set from the B61 AAU did not reveal signs of catastrophic failure. Quantitative analyses of the microstructural metrics of intermetallic compound layer thickness and Pb-rich phase particle distributions indicated solder joint aging that was commensurate with the accelerated aging environment. The effects of stress-enhanced coarsening of the Pb-rich phase were also documented.

Physical Description

4 p.

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OSTI as DE98000207

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  • 21. aging, compatibility, and stockpile stewardship conference, Albuquerque, NM (United States), 30 Sep - 2 Oct 1997

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  • Other: DE98000207
  • Report No.: SAND--97-2066C
  • Report No.: CONF-970982--
  • Grant Number: AC04-94AL85000
  • Office of Scientific & Technical Information Report Number: 541911
  • Archival Resource Key: ark:/67531/metadc694520

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Reports, articles and other documents harvested from the Office of Scientific and Technical Information.

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  • October 1, 1997

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  • Aug. 14, 2015, 8:43 a.m.

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  • April 14, 2016, 12:45 p.m.

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Vianco, P.T. & Rejent, J.A. Solder joint aging characteristics from the MC2918 firing set of a B61 accelerated aging unit (AAU), article, October 1, 1997; Albuquerque, New Mexico. (digital.library.unt.edu/ark:/67531/metadc694520/: accessed August 18, 2018), University of North Texas Libraries, Digital Library, digital.library.unt.edu; crediting UNT Libraries Government Documents Department.