Areal array jetting device for ball grid arrays

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Description

Package designs for microelectronics devices have moved from through-hole to surface mount technology in order to increase the printed wiring board real estate available by utilizing both sides of the board. The traditional geometry for surface mount devices is peripheral arrays where the leads are on the edges of the device. As the technology drives towards high input/output (I/O) count (increasing number of leads) and smaller packages with finer pitch (less distance between peripheral leads), limitations on peripheral surface mount devices arise. A solution to the peripheral surface mount issue is to shift the leads to the area under the ... continued below

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7 p.

Creation Information

Frear, D.R.; Yost, F.G.; Schmale, D.T. & Essien, M. August 1, 1997.

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  • Sandia National Laboratories
    Publisher Info: Sandia National Labs., Albuquerque, NM (United States)
    Place of Publication: Albuquerque, New Mexico

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Description

Package designs for microelectronics devices have moved from through-hole to surface mount technology in order to increase the printed wiring board real estate available by utilizing both sides of the board. The traditional geometry for surface mount devices is peripheral arrays where the leads are on the edges of the device. As the technology drives towards high input/output (I/O) count (increasing number of leads) and smaller packages with finer pitch (less distance between peripheral leads), limitations on peripheral surface mount devices arise. A solution to the peripheral surface mount issue is to shift the leads to the area under the device. This scheme is called areal array packaging and is exemplified by the ball grid array (BGA) package. In a BGA package, the leads are on the bottom surface of the package in the form of an array of solder balls. The current practice of joining BGA packages to printed wiring boards involves a hierarchy of solder alloy compositions. A high melting temperature ball is typically used for standoff. A promising alternative to current methods is the use of jetting technology to perform monolithic solder ball attachment. This paper describes an areal array jetter that was designed and built to simultaneously jet arrays of solder balls directly onto BGA substrates.

Physical Description

7 p.

Notes

OSTI as DE97007915

Source

  • 7. annual surface mount international conference, San Jose, CA (United States), 7-11 Sep 1997

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  • Other: DE97007915
  • Report No.: SAND--97-1780C
  • Report No.: CONF-970977--1
  • Grant Number: AC04-94AL85000
  • Office of Scientific & Technical Information Report Number: 515650
  • Archival Resource Key: ark:/67531/metadc693283

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Office of Scientific & Technical Information Technical Reports

Reports, articles and other documents harvested from the Office of Scientific and Technical Information.

Office of Scientific and Technical Information (OSTI) is the Department of Energy (DOE) office that collects, preserves, and disseminates DOE-sponsored research and development (R&D) results that are the outcomes of R&D projects or other funded activities at DOE labs and facilities nationwide and grantees at universities and other institutions.

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Creation Date

  • August 1, 1997

Added to The UNT Digital Library

  • Aug. 14, 2015, 8:43 a.m.

Description Last Updated

  • April 14, 2016, 3:12 p.m.

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Frear, D.R.; Yost, F.G.; Schmale, D.T. & Essien, M. Areal array jetting device for ball grid arrays, article, August 1, 1997; Albuquerque, New Mexico. (digital.library.unt.edu/ark:/67531/metadc693283/: accessed September 19, 2018), University of North Texas Libraries, Digital Library, digital.library.unt.edu; crediting UNT Libraries Government Documents Department.