High-G accelerometer for earth-penetrator weapons applications. LDRD final report

PDF Version Also Available for Download.

Description

Micromachining technologies, or Micro-Electro-Mechanical Systems (MEMS), enable the develop of low-cost devices capable of sensing motion in a reliable and accurate manner. Sandia has developed a MEMS fabrication process for integrating both the micromechanical structures and microelectronics circuitry of surface micromachined sensors, such as silicon accelerometers, on the same chip. Integration of the micromechanical sensor elements with microelectronics provides substantial performance and reliability advantages for MEMS accelerometers. A design team at Sandia was assembled to develop a micromachined silicon accelerometer capable of surviving and measuring very high accelerations (up to 50,000 times the acceleration due to gravity). The Sandia integrated ... continued below

Physical Description

41 p.

Creation Information

Davies, B.R.; Montague, S.; Bateman, V.I.; Brown, F.A.; Chanchani, R.; Christenson, T. et al. March 1, 1998.

Context

This report is part of the collection entitled: Office of Scientific & Technical Information Technical Reports and was provided by UNT Libraries Government Documents Department to Digital Library, a digital repository hosted by the UNT Libraries. It has been viewed 24 times . More information about this report can be viewed below.

Who

People and organizations associated with either the creation of this report or its content.

Sponsor

Publisher

  • Sandia National Laboratories
    Publisher Info: Sandia National Labs., Albuquerque, NM (United States)
    Place of Publication: Albuquerque, New Mexico

Provided By

UNT Libraries Government Documents Department

Serving as both a federal and a state depository library, the UNT Libraries Government Documents Department maintains millions of items in a variety of formats. The department is a member of the FDLP Content Partnerships Program and an Affiliated Archive of the National Archives.

Contact Us

What

Descriptive information to help identify this report. Follow the links below to find similar items on the Digital Library.

Description

Micromachining technologies, or Micro-Electro-Mechanical Systems (MEMS), enable the develop of low-cost devices capable of sensing motion in a reliable and accurate manner. Sandia has developed a MEMS fabrication process for integrating both the micromechanical structures and microelectronics circuitry of surface micromachined sensors, such as silicon accelerometers, on the same chip. Integration of the micromechanical sensor elements with microelectronics provides substantial performance and reliability advantages for MEMS accelerometers. A design team at Sandia was assembled to develop a micromachined silicon accelerometer capable of surviving and measuring very high accelerations (up to 50,000 times the acceleration due to gravity). The Sandia integrated surface micromachining process was selected for fabrication of the sensor due to the extreme measurement sensitivity potential associated with integrated microelectronics. Very fine measurement sensitivity was required due to the very small accelerometer proof mass (< 200 {times} 10{sup {minus}9} gram) obtainable with this surface micromachining process. The small proof mass corresponded to small sensor deflections which required very sensitive electronics to enable accurate acceleration measurement over a range of 1,000 to 50,000 times the acceleration due to gravity. Several prototype sensors, based on a suspended plate mass configuration, were developed and the details of the design, modeling, fabrication and validation of the device will be presented in this paper. The device was analyzed using both conventional lumped parameter modeling techniques and finite element analysis tools. The device was tested and performed well over its design range (the device was tested over a range of a few thousand G to 46,000 G, where 1 G equals the acceleration due to gravity).

Physical Description

41 p.

Notes

OSTI as DE98002823

Source

  • Other Information: PBD: Mar 1998

Language

Item Type

Identifier

Unique identifying numbers for this report in the Digital Library or other systems.

  • Other: DE98002823
  • Report No.: SAND--98-0510
  • Grant Number: AC04-94AL85000
  • DOI: 10.2172/573342 | External Link
  • Office of Scientific & Technical Information Report Number: 573342
  • Archival Resource Key: ark:/67531/metadc693246

Collections

This report is part of the following collection of related materials.

Office of Scientific & Technical Information Technical Reports

Reports, articles and other documents harvested from the Office of Scientific and Technical Information.

Office of Scientific and Technical Information (OSTI) is the Department of Energy (DOE) office that collects, preserves, and disseminates DOE-sponsored research and development (R&D) results that are the outcomes of R&D projects or other funded activities at DOE labs and facilities nationwide and grantees at universities and other institutions.

What responsibilities do I have when using this report?

When

Dates and time periods associated with this report.

Creation Date

  • March 1, 1998

Added to The UNT Digital Library

  • Aug. 14, 2015, 8:43 a.m.

Description Last Updated

  • May 18, 2016, 5:46 p.m.

Usage Statistics

When was this report last used?

Yesterday: 0
Past 30 days: 2
Total Uses: 24

Interact With This Report

Here are some suggestions for what to do next.

Start Reading

PDF Version Also Available for Download.

International Image Interoperability Framework

IIF Logo

We support the IIIF Presentation API

Davies, B.R.; Montague, S.; Bateman, V.I.; Brown, F.A.; Chanchani, R.; Christenson, T. et al. High-G accelerometer for earth-penetrator weapons applications. LDRD final report, report, March 1, 1998; Albuquerque, New Mexico. (digital.library.unt.edu/ark:/67531/metadc693246/: accessed September 22, 2018), University of North Texas Libraries, Digital Library, digital.library.unt.edu; crediting UNT Libraries Government Documents Department.