Thermal resistance across a copper/Kapton/copper interface at cryogenic temperatures

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Description

The high-{Tc} superconductor current lead heat intercept connection, which is utilized as a thermal intercept to remove the Joule heat from the upper stage lead to a heat sink operating at 50--77 K, consists of a structure where a 152-{micro}m film is sandwiched between two concentric copper cylinders. The material chosen for the insulating film is Kapton MT, a composite film which has a relatively low thermal resistance, but yet a high voltage standoff capability. Here, the measured thermal conductance of a copper/Kapton MT/copper junction in a flat-plate geometry is compared to the results obtained from the actual heat intercept ... continued below

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9 p.

Creation Information

Zhao, L.; Phelan, P. E.; Niemann, R. C. & Weber, B. R. September 1997.

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This report is part of the collection entitled: Office of Scientific & Technical Information Technical Reports and was provided by UNT Libraries Government Documents Department to Digital Library, a digital repository hosted by the UNT Libraries. It has been viewed 30 times . More information about this report can be viewed below.

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  • Zhao, L.
  • Phelan, P. E. Arizona State Univ., Tempe, AZ (United States). Dept. of Mechanical and Aerospace Engineering
  • Niemann, R. C. Argonne National Lab., IL (United States)
  • Weber, B. R. Superconductivity, Inc., Madison, WI (United States)

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Description

The high-{Tc} superconductor current lead heat intercept connection, which is utilized as a thermal intercept to remove the Joule heat from the upper stage lead to a heat sink operating at 50--77 K, consists of a structure where a 152-{micro}m film is sandwiched between two concentric copper cylinders. The material chosen for the insulating film is Kapton MT, a composite film which has a relatively low thermal resistance, but yet a high voltage standoff capability. Here, the measured thermal conductance of a copper/Kapton MT/copper junction in a flat-plate geometry is compared to the results obtained from the actual heat intercept connection. Increasing the contact pressure reduces the thermal resistance to a minimum value determined by the film conduction resistance. A comparison between the resistance of the copper/Kapton MT/copper junction and a copper/G-10/copper junction demonstrates that the Kapton MT layer yields a lower thermal resistance while still providing adequate electrical isolation.

Physical Description

9 p.

Notes

INIS; OSTI as DE97054010

Source

  • Joint cryogenic engineering conference and international cryogenic materials conference, Portland, OR (United States), 27 Jul - 1 Aug 1997

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  • Other: DE97054010
  • Report No.: ANL/ET/CP--92012
  • Report No.: CONF-970758--
  • Grant Number: W-31109-ENG-38
  • DOI: 10.2172/554889 | External Link
  • Office of Scientific & Technical Information Report Number: 554889
  • Archival Resource Key: ark:/67531/metadc692962

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Office of Scientific & Technical Information Technical Reports

Reports, articles and other documents harvested from the Office of Scientific and Technical Information.

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Creation Date

  • September 1997

Added to The UNT Digital Library

  • Aug. 14, 2015, 8:43 a.m.

Description Last Updated

  • Nov. 13, 2015, 11:30 p.m.

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Zhao, L.; Phelan, P. E.; Niemann, R. C. & Weber, B. R. Thermal resistance across a copper/Kapton/copper interface at cryogenic temperatures, report, September 1997; Illinois. (digital.library.unt.edu/ark:/67531/metadc692962/: accessed December 14, 2017), University of North Texas Libraries, Digital Library, digital.library.unt.edu; crediting UNT Libraries Government Documents Department.