Mechanical properties of Pb-free solder alloys on thick film hybrid microcircuits

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The technology drivers of the electronics industry continue to be systems miniaturization and reliability, in addition to addressing a variety of important environmental issues. Although the Sn-Pb eutectic alloy is widely used as a joining material in the electronics industry, it has drawn environmental concern due to its Pb content. The solder acts both as an electrical and mechanical connection within the different packaging levels in an electronic device. New Pb-free solders are being developed at Sandia National Laboratories. The alloys are based on the Sn-Ag alloy, having Bi and Au additions. Prototype hybrid microcircuit (HMC) test vehicles have been ... continued below

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10 p.

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Hernandez, C.L.; Vianco, P.T.; Rejent, J.A. & Hosking, F.M. March 10, 1998.

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  • Sandia National Laboratories
    Publisher Info: Sandia National Labs., Albuquerque, NM (United States)
    Place of Publication: Albuquerque, New Mexico

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Description

The technology drivers of the electronics industry continue to be systems miniaturization and reliability, in addition to addressing a variety of important environmental issues. Although the Sn-Pb eutectic alloy is widely used as a joining material in the electronics industry, it has drawn environmental concern due to its Pb content. The solder acts both as an electrical and mechanical connection within the different packaging levels in an electronic device. New Pb-free solders are being developed at Sandia National Laboratories. The alloys are based on the Sn-Ag alloy, having Bi and Au additions. Prototype hybrid microcircuit (HMC) test vehicles have been assembled to evaluate Pb-free solders for Au-Pt-Pd thick film soldering. The test components consist of a variety of dummy chip capacitors and leadless ceramic chip carriers (LCCC`s). The mechanical properties of the joints were evaluated. The reflow profiles and the solid state intermetallic formation reaction will also be presented. Improved solder joint manufacturability and increased fatigue resistance solder alloys are the goals of these materials.

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10 p.

Notes

OSTI as DE98002810

Source

  • IPC printed circuits expo `98, Long Beach, CA (United States), 26-30 Apr 1998

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  • Other: DE98002810
  • Report No.: SAND--97-2578C
  • Report No.: CONF-980422--
  • Grant Number: AC04-94AL85000
  • DOI: 10.2172/676869 | External Link
  • Office of Scientific & Technical Information Report Number: 642720
  • Archival Resource Key: ark:/67531/metadc692461

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Office of Scientific & Technical Information Technical Reports

Reports, articles and other documents harvested from the Office of Scientific and Technical Information.

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Creation Date

  • March 10, 1998

Added to The UNT Digital Library

  • Aug. 14, 2015, 8:43 a.m.

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  • April 14, 2016, 7:52 p.m.

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Hernandez, C.L.; Vianco, P.T.; Rejent, J.A. & Hosking, F.M. Mechanical properties of Pb-free solder alloys on thick film hybrid microcircuits, article, March 10, 1998; Albuquerque, New Mexico. (digital.library.unt.edu/ark:/67531/metadc692461/: accessed June 19, 2018), University of North Texas Libraries, Digital Library, digital.library.unt.edu; crediting UNT Libraries Government Documents Department.