Epoxy Foam Encapsulants: Processing and Dielectric Characterization

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Description

The dielectric performance of epoxy foams was investigated to determine if such materials might provide advantages over more standard polyurethane foams in the encapsulation of electronic assemblies. Comparisons of the dielectric characteristics of epoxy and urethane encapsulant foams found no significant differences between the two resin types and no significant difference between as-molded and machined foams. This study specifically evaluated the formulation and processing of epoxy foams using simple methylhydrosiloxanes as the flowing agent and compared the dielectric performance of those to urethane foams of similar density.

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Domeier, Linda & Hunter, Marion January 1, 1999.

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This report is part of the collection entitled: Office of Scientific & Technical Information Technical Reports and was provided by UNT Libraries Government Documents Department to Digital Library, a digital repository hosted by the UNT Libraries. It has been viewed 31 times . More information about this report can be viewed below.

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  • Sandia National Laboratories
    Publisher Info: Sandia National Labs., Albuquerque, NM, and Livermore, CA (United States)
    Place of Publication: Albuquerque, New Mexico

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Description

The dielectric performance of epoxy foams was investigated to determine if such materials might provide advantages over more standard polyurethane foams in the encapsulation of electronic assemblies. Comparisons of the dielectric characteristics of epoxy and urethane encapsulant foams found no significant differences between the two resin types and no significant difference between as-molded and machined foams. This study specifically evaluated the formulation and processing of epoxy foams using simple methylhydrosiloxanes as the flowing agent and compared the dielectric performance of those to urethane foams of similar density.

Physical Description

Medium: P; Size: vp.

Notes

OSTI as DE00005988

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  • Other Information: PBD: 1 Jan 1999

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Reports, articles and other documents harvested from the Office of Scientific and Technical Information.

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  • January 1, 1999

Added to The UNT Digital Library

  • Aug. 14, 2015, 8:43 a.m.

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  • April 11, 2016, 4:25 p.m.

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Domeier, Linda & Hunter, Marion. Epoxy Foam Encapsulants: Processing and Dielectric Characterization, report, January 1, 1999; Albuquerque, New Mexico. (digital.library.unt.edu/ark:/67531/metadc691974/: accessed April 27, 2018), University of North Texas Libraries, Digital Library, digital.library.unt.edu; crediting UNT Libraries Government Documents Department.