Environmentally compatible solder materials for thick film hybrid assemblies

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New soldering materials and processes have been developed over the last several years to address a variety of environmental issues. One of the primary efforts by the electronics industry has involved the development of alternative solders to replace the traditional lead-containing alloys. Sandia National Laboratories is developing such alternative solder materials for printed circuit board and hybrid microcircuit (HMC) applications. This paper describes the work associated with low residue, lead-free soldering of thick film HMC`s. The response of the different materials to wetting, aging, and mechanical test conditions was investigated. Hybrid test vehicles were designed and fabricated with a variety ... continued below

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8 p.

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Hosking, F.M.; Vianco, P.T.; Rejent, J.A. & Hernandez, C.L. February 1, 1997.

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  • Sandia National Laboratories
    Publisher Info: Sandia National Labs., Albuquerque, NM (United States)
    Place of Publication: Albuquerque, New Mexico

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Description

New soldering materials and processes have been developed over the last several years to address a variety of environmental issues. One of the primary efforts by the electronics industry has involved the development of alternative solders to replace the traditional lead-containing alloys. Sandia National Laboratories is developing such alternative solder materials for printed circuit board and hybrid microcircuit (HMC) applications. This paper describes the work associated with low residue, lead-free soldering of thick film HMC`s. The response of the different materials to wetting, aging, and mechanical test conditions was investigated. Hybrid test vehicles were designed and fabricated with a variety of chip capacitors and leadless ceramic chip carriers to conduct thermal, electrical continuity, and mechanical evaluations of prototype joints. Microstructural development along the solder and thick film interface, after isothermal solid state aging over a range of elevated temperatures and times, was quantified using microanalytical techniques. Flux residues on soldered samples were stressed (temperature-humidity aged) to identify potential corrosion problems. Mechanical tests also supported the development of a solder joint lifetime prediction model. Progress of this effort is summarized.

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8 p.

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OSTI as DE97002649

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  • ASME international intersociety electronic and photonic packaging conference and exhibition, Honolulu, HI (United States), 15-19 Jun 1997

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  • Other: DE97002649
  • Report No.: SAND--97-0109C
  • Report No.: CONF-970616--3
  • Grant Number: AC04-94AL85000
  • Office of Scientific & Technical Information Report Number: 486150
  • Archival Resource Key: ark:/67531/metadc689520

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Office of Scientific & Technical Information Technical Reports

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  • February 1, 1997

Added to The UNT Digital Library

  • Aug. 11, 2015, 8 p.m.

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  • April 14, 2016, 8:29 p.m.

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Hosking, F.M.; Vianco, P.T.; Rejent, J.A. & Hernandez, C.L. Environmentally compatible solder materials for thick film hybrid assemblies, article, February 1, 1997; Albuquerque, New Mexico. (digital.library.unt.edu/ark:/67531/metadc689520/: accessed October 18, 2018), University of North Texas Libraries, Digital Library, digital.library.unt.edu; crediting UNT Libraries Government Documents Department.