Statistics: Modeling and Simulation - The Effects of Grain Coarsening on Local Stresses and Strains in Solder Microstructure

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This article is part of the collection entitled: Office of Scientific & Technical Information Technical Reports and was provided by UNT Libraries Government Documents Department to Digital Library, a digital repository hosted by the UNT Libraries. It has been viewed 32 times , with 5 in the last month . More information about this article can be viewed below.

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