Material development of polymer/metal paste for flip-chip attach interconnection technology

PDF Version Also Available for Download.

Description

Upon completion of the second year of this contract, we have delivered the next generation of polymer/metal composite, optimum paste H, to Endicott. We have done preliminary flip-chip type bonding at Universal Instruments, working closely with their personnel to enhance their equipment set and process. We have also shown that a PMC bond can withstand over 40% strain without effecting its electrical and mechanical properties. This resilience of the conductive polymer paste both under electrical and mechanical behavior, is a strong indication of the applicability of the material for Flip Chip Attach to organic laminates. We have also confirmed during ... continued below

Physical Description

16 p.

Creation Information

Roldann, J.M.; Saraf, R.F.; Sambucetti, C.J. & Cotte, J. November 1, 1996.

Context

This report is part of the collection entitled: Office of Scientific & Technical Information Technical Reports and was provided by UNT Libraries Government Documents Department to Digital Library, a digital repository hosted by the UNT Libraries. More information about this report can be viewed below.

Who

People and organizations associated with either the creation of this report or its content.

Provided By

UNT Libraries Government Documents Department

Serving as both a federal and a state depository library, the UNT Libraries Government Documents Department maintains millions of items in a variety of formats. The department is a member of the FDLP Content Partnerships Program and an Affiliated Archive of the National Archives.

Contact Us

What

Descriptive information to help identify this report. Follow the links below to find similar items on the Digital Library.

Description

Upon completion of the second year of this contract, we have delivered the next generation of polymer/metal composite, optimum paste H, to Endicott. We have done preliminary flip-chip type bonding at Universal Instruments, working closely with their personnel to enhance their equipment set and process. We have also shown that a PMC bond can withstand over 40% strain without effecting its electrical and mechanical properties. This resilience of the conductive polymer paste both under electrical and mechanical behavior, is a strong indication of the applicability of the material for Flip Chip Attach to organic laminates. We have also confirmed during this phase of the Contract that the Optimum Paste H can be processed and applied under normal ambient conditions, without special precautions of low temperature or inert atmospheres, a property which sets our system apart from many other commercial pastes. We would also like to remark the achievement of optimized paste properties and how these properties address the mayor issues and requirements for flip attach applications, in Table I and II of this report. Use of the PMC to build interposer for chip-testing. Due to the high electrical conductivity of the PMC, a process was developed to use a thin film layer of the paste applied to a metal cathode of an electrochemical cell, to build fully metallized thru hole arrays containing a given C-4 chip foot print. This array interposers can be used for chip test (known-good-chip) applications. This process will be described in detail at the Year-End Review Meeting in Binghanton.

Physical Description

16 p.

Notes

OSTI as DE97000822

Source

  • Other Information: PBD: Nov 1996

Language

Item Type

Identifier

Unique identifying numbers for this report in the Digital Library or other systems.

  • Other: DE97000822
  • Report No.: DOE/AL/98817--8-Pt.1
  • Grant Number: FC04-94AL98817
  • DOI: 10.2172/399735 | External Link
  • Office of Scientific & Technical Information Report Number: 399735
  • Archival Resource Key: ark:/67531/metadc688945

Collections

This report is part of the following collection of related materials.

Office of Scientific & Technical Information Technical Reports

What responsibilities do I have when using this report?

When

Dates and time periods associated with this report.

Creation Date

  • November 1, 1996

Added to The UNT Digital Library

  • July 25, 2015, 2:20 a.m.

Description Last Updated

  • Nov. 24, 2015, 11:54 a.m.

Usage Statistics

When was this report last used?

Yesterday: 0
Past 30 days: 1
Total Uses: 6

Interact With This Report

Here are some suggestions for what to do next.

Start Reading

PDF Version Also Available for Download.

Citations, Rights, Re-Use

Roldann, J.M.; Saraf, R.F.; Sambucetti, C.J. & Cotte, J. Material development of polymer/metal paste for flip-chip attach interconnection technology, report, November 1, 1996; United States. (digital.library.unt.edu/ark:/67531/metadc688945/: accessed September 19, 2017), University of North Texas Libraries, Digital Library, digital.library.unt.edu; crediting UNT Libraries Government Documents Department.