IMAP: Interferometry for Material Property Measurement in MEMS

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Description

An interferometric technique has been developed for non-destructive, high-confidence, in-situ determination of material properties in MEMS. By using interferometry to measure the full deflection curves of beams pulled toward the substrate under electrostatic loads, the actual behavior of the beams has been modeled. No other method for determining material properties allows such detailed knowledge of device behavior to be gathered. Values for material properties and non-idealities (such as support post compliance) have then been extracted which minimize the error between the measured and modeled deflections. High accuracy and resolution have been demonstrated, allowing the measurements to be used to enhance ... continued below

Physical Description

5 p.

Creation Information

Jensen, B.D.; Miller, S.L. & de Boer, M.P. March 10, 1999.

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This article is part of the collection entitled: Office of Scientific & Technical Information Technical Reports and was provided by UNT Libraries Government Documents Department to Digital Library, a digital repository hosted by the UNT Libraries. More information about this article can be viewed below.

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  • Sandia National Laboratories
    Publisher Info: Sandia National Labs., Albuquerque, NM, and Livermore, CA (United States)
    Place of Publication: Albuquerque, New Mexico

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Description

An interferometric technique has been developed for non-destructive, high-confidence, in-situ determination of material properties in MEMS. By using interferometry to measure the full deflection curves of beams pulled toward the substrate under electrostatic loads, the actual behavior of the beams has been modeled. No other method for determining material properties allows such detailed knowledge of device behavior to be gathered. Values for material properties and non-idealities (such as support post compliance) have then been extracted which minimize the error between the measured and modeled deflections. High accuracy and resolution have been demonstrated, allowing the measurements to be used to enhance process control.

Physical Description

5 p.

Notes

OSTI as DE00004275

Medium: P; Size: 5 pages

Source

  • Modeling and Simulation of Microsystems '99, San Juan (PR), 04/19/1999--04/21/1999

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Identifier

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  • Report No.: SAND99-0586C
  • Grant Number: AC04-94AL85000
  • Office of Scientific & Technical Information Report Number: 4275
  • Archival Resource Key: ark:/67531/metadc687332

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Creation Date

  • March 10, 1999

Added to The UNT Digital Library

  • July 25, 2015, 2:20 a.m.

Description Last Updated

  • April 11, 2017, 12:36 p.m.

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Jensen, B.D.; Miller, S.L. & de Boer, M.P. IMAP: Interferometry for Material Property Measurement in MEMS, article, March 10, 1999; Albuquerque, New Mexico. (digital.library.unt.edu/ark:/67531/metadc687332/: accessed September 22, 2017), University of North Texas Libraries, Digital Library, digital.library.unt.edu; crediting UNT Libraries Government Documents Department.