Mini ball grid array (mBGA) assembly on MCM-L boards

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Description

Sandia National Laboratories has developed a chip scale packaging technology called mini Ball Grid Array (mBGA). The mBGA is a flip chip die, obtained by redistributing peripheral pads in existing dies to an area array of pads 10 mils or larger in diameter with a minimum pitch of 20 mils. The peripheral pads are redistributed to area array pads using two polyimide dielectric and two metal conductor layers. mBGA can be closely tiled together on a substrate to yield a very high circuit density. In an earlier report, the authors presented the results on the reliability and thermal performance of ... continued below

Physical Description

9 p.

Creation Information

Chanchani, R.; Treece, K. & Dressendorfer, P. February 1, 1997.

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This report is part of the collection entitled: Office of Scientific & Technical Information Technical Reports and was provided by UNT Libraries Government Documents Department to Digital Library, a digital repository hosted by the UNT Libraries. More information about this report can be viewed below.

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  • Sandia National Laboratories
    Publisher Info: Sandia National Labs., Albuquerque, NM (United States)
    Place of Publication: Albuquerque, New Mexico

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Description

Sandia National Laboratories has developed a chip scale packaging technology called mini Ball Grid Array (mBGA). The mBGA is a flip chip die, obtained by redistributing peripheral pads in existing dies to an area array of pads 10 mils or larger in diameter with a minimum pitch of 20 mils. The peripheral pads are redistributed to area array pads using two polyimide dielectric and two metal conductor layers. mBGA can be closely tiled together on a substrate to yield a very high circuit density. In an earlier report, the authors presented the results on the reliability and thermal performance of mBGA on silicon and ceramic substrates. In this report, they present an mBGA cost analysis, improvements in the mBGA bump adhesion, and reliability and thermal performance of mBGA assemblies on FR-4 boards.

Physical Description

9 p.

Notes

OSTI as DE97003008

Source

  • 47. electronic components and technology conference, San Jose, CA (United States), 18-21 May 1997

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Identifier

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  • Other: DE97003008
  • Report No.: SAND--97-0314C
  • Report No.: CONF-970569--1
  • Grant Number: AC04-94AL85000
  • DOI: 10.2172/463644 | External Link
  • Office of Scientific & Technical Information Report Number: 463644
  • Archival Resource Key: ark:/67531/metadc686444

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Office of Scientific & Technical Information Technical Reports

Reports, articles and other documents harvested from the Office of Scientific and Technical Information.

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Creation Date

  • February 1, 1997

Added to The UNT Digital Library

  • July 25, 2015, 2:21 a.m.

Description Last Updated

  • April 13, 2016, 3:01 p.m.

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Chanchani, R.; Treece, K. & Dressendorfer, P. Mini ball grid array (mBGA) assembly on MCM-L boards, report, February 1, 1997; Albuquerque, New Mexico. (digital.library.unt.edu/ark:/67531/metadc686444/: accessed September 22, 2018), University of North Texas Libraries, Digital Library, digital.library.unt.edu; crediting UNT Libraries Government Documents Department.