Modeling non-isothermal intermetallic layer growth in the 63Sn-37Pb/Cu system

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A model describing diffusion-controlled growth of multiple intermetallic layers and the displacement of the interfaces between layers was developed and implemented in a 1-D computer code based on method-of-lines. The code was applied to analysis of intermetallic layer growth in isothermal solder aging experiments performed with 100 Sn/Cu and 63Sn-37Pb/Cu solder-substrate systems. Analyses indicated that intermetallic layer growth was consistent with a bulk diffusion mechanism involving Cu and/or Sn. In this work, nonisothermal solder-aging experiments were done with the 63Sn- 37Pb/Cu system using two temperature histories (4 cycles/day between 223-443 K, and 72 cycles/day between 223-443 K). Isothermal experiments were ... continued below

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10 p.

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Vianco, P.T.; Hopkins, P.L.; Erickson, K.L.; Frear, D.R. & Davidson, R. December 31, 1996.

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  • Sandia National Laboratories
    Publisher Info: Sandia National Labs., Albuquerque, NM (United States)
    Place of Publication: Albuquerque, New Mexico

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Description

A model describing diffusion-controlled growth of multiple intermetallic layers and the displacement of the interfaces between layers was developed and implemented in a 1-D computer code based on method-of-lines. The code was applied to analysis of intermetallic layer growth in isothermal solder aging experiments performed with 100 Sn/Cu and 63Sn-37Pb/Cu solder-substrate systems. Analyses indicated that intermetallic layer growth was consistent with a bulk diffusion mechanism involving Cu and/or Sn. In this work, nonisothermal solder-aging experiments were done with the 63Sn- 37Pb/Cu system using two temperature histories (4 cycles/day between 223-443 K, and 72 cycles/day between 223-443 K). Isothermal experiments were also done at 443 K. Thickness of Cu{sub 3}Sn and Cu{sub 6}Sn{sub 5} intermetallic layers were determined vs time for each temperature history. An updated version of the model and code were used to predict the intermetallic layer growth. Arrhenius expressions for diffusion coefficients in both Cu3Sn and Cu6Sn5 layers were determined. Agreement between prediction and experiment was generally good. In some cases, predicted layer growth was less than experiment, but within error. This paper describes the nonisothermal experiments and a comparison of predicted and observed layer growth vs time.

Physical Description

10 p.

Notes

OSTI as DE97000662

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  • 126. annual meeting of the Minerals, Metals and Materials Society, Orlando, FL (United States), 9-13 Feb 1997

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  • Other: DE97000662
  • Report No.: SAND--96-0951C
  • Report No.: CONF-970201--7
  • Grant Number: AC04-94AL85000
  • Office of Scientific & Technical Information Report Number: 437658
  • Archival Resource Key: ark:/67531/metadc686372

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  • December 31, 1996

Added to The UNT Digital Library

  • July 25, 2015, 2:20 a.m.

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  • April 14, 2016, 8:40 p.m.

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Vianco, P.T.; Hopkins, P.L.; Erickson, K.L.; Frear, D.R. & Davidson, R. Modeling non-isothermal intermetallic layer growth in the 63Sn-37Pb/Cu system, article, December 31, 1996; Albuquerque, New Mexico. (https://digital.library.unt.edu/ark:/67531/metadc686372/: accessed May 23, 2019), University of North Texas Libraries, Digital Library, https://digital.library.unt.edu; crediting UNT Libraries Government Documents Department.