Assessment of microelectronics packaging for high temperature, high reliability applications

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Description

This report details characterization and development activities in electronic packaging for high temperature applications. This project was conducted through a Department of Energy sponsored Cooperative Research and Development Agreement between Sandia National Laboratories and General Motors. Even though the target application of this collaborative effort is an automotive electronic throttle control system which would be located in the engine compartment, results of this work are directly applicable to Sandia`s national security mission. The component count associated with the throttle control dictates the use of high density packaging not offered by conventional surface mount. An enabling packaging technology was selected and ... continued below

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Medium: P; Size: 403 p.

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Uribe, F. April 1, 1997.

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This report is part of the collection entitled: Office of Scientific & Technical Information Technical Reports and was provided by UNT Libraries Government Documents Department to Digital Library, a digital repository hosted by the UNT Libraries. It has been viewed 22 times . More information about this report can be viewed below.

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  • Sandia National Laboratories
    Publisher Info: Sandia National Labs., Albuquerque, NM (United States)
    Place of Publication: Albuquerque, New Mexico

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Description

This report details characterization and development activities in electronic packaging for high temperature applications. This project was conducted through a Department of Energy sponsored Cooperative Research and Development Agreement between Sandia National Laboratories and General Motors. Even though the target application of this collaborative effort is an automotive electronic throttle control system which would be located in the engine compartment, results of this work are directly applicable to Sandia`s national security mission. The component count associated with the throttle control dictates the use of high density packaging not offered by conventional surface mount. An enabling packaging technology was selected and thermal models defined which characterized the thermal and mechanical response of the throttle control module. These models were used to optimize thick film multichip module design, characterize the thermal signatures of the electronic components inside the module, and to determine the temperature field and resulting thermal stresses under conditions that may be encountered during the operational life of the throttle control module. Because the need to use unpackaged devices limits the level of testing that can be performed either at the wafer level or as individual dice, an approach to assure a high level of reliability of the unpackaged components was formulated. Component assembly and interconnect technologies were also evaluated and characterized for high temperature applications. Electrical, mechanical and chemical characterizations of enabling die and component attach technologies were performed. Additionally, studies were conducted to assess the performance and reliability of gold and aluminum wire bonding to thick film conductor inks. Kinetic models were developed and validated to estimate wire bond reliability.

Physical Description

Medium: P; Size: 403 p.

Notes

OSTI as DE97006307

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  • Other Information: PBD: Apr 1997

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  • Other: DE97006307
  • Report No.: SAND--97-0745
  • Grant Number: AC04-94AL85000
  • DOI: 10.2172/477773 | External Link
  • Office of Scientific & Technical Information Report Number: 477773
  • Archival Resource Key: ark:/67531/metadc686099

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Office of Scientific & Technical Information Technical Reports

Reports, articles and other documents harvested from the Office of Scientific and Technical Information.

Office of Scientific and Technical Information (OSTI) is the Department of Energy (DOE) office that collects, preserves, and disseminates DOE-sponsored research and development (R&D) results that are the outcomes of R&D projects or other funded activities at DOE labs and facilities nationwide and grantees at universities and other institutions.

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  • April 1, 1997

Added to The UNT Digital Library

  • July 25, 2015, 2:21 a.m.

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  • April 13, 2016, 12:56 p.m.

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Uribe, F. Assessment of microelectronics packaging for high temperature, high reliability applications, report, April 1, 1997; Albuquerque, New Mexico. (digital.library.unt.edu/ark:/67531/metadc686099/: accessed December 11, 2017), University of North Texas Libraries, Digital Library, digital.library.unt.edu; crediting UNT Libraries Government Documents Department.