Fabrication of high-density cantilever arrays and through-wafer interconnects Metadata

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Title

  • Main Title Fabrication of high-density cantilever arrays and through-wafer interconnects

Creator

  • Author: A. Harley, J.
    Creator Type: Personal
  • Author: Abdollahi-Alibeik, S.
    Creator Type: Personal
  • Author: Chow, E. M.
    Creator Type: Personal
  • Author: Kenney, T. W.
    Creator Type: Personal
  • Author: McCarthy, A. M.
    Creator Type: Personal
  • Author: McVittie, J. P.
    Creator Type: Personal
  • Author: Partridge
    Creator Type: Personal
  • Author: Quate, C. F.
    Creator Type: Personal
  • Author: Soh, H. T.
    Creator Type: Personal

Contributor

  • Sponsor: United States. Department of Energy. Office of the Assistant Secretary for Defense Programs.
    Contributor Type: Organization
    Contributor Info: USDOE Office of Defense Programs (DP)

Publisher

  • Name: Lawrence Livermore National Laboratory
    Place of Publication: Livermore, California
    Additional Info: Lawrence Livermore National Laboratory, Livermore, CA

Date

  • Creation: 1998-11-03

Language

  • English

Description

  • Content Description: Processes to fabricate dense, dry released microstructures with electrical connections on the opposite side of the wafer are described. A 10 x 10 array of silicon and polysilicon cantilevers with high packing density (5 tips/mm<sup>2</sup>) and high uniformity (<10 µm length variation across the wafer) are demonstrated. The cantilever release process uses a deep SF<sub>6</sub>/C<sub>4</sub>F<sub>8</sub>, plasma etch followed by a HBr plasma etch to accurately release cantilevers. A process for fabricating electrical contacts through the backside of the wafer is also described. Electrodeposited resist, conformal CVD metal deposition and deep SF<sub>6</sub>/C<sub>4</sub>F<sub>8</sub> plasma etching are used to make 30 µm/side square vias each of which has a resistance of 50 m(omega).
  • Physical Description: 597 Kilobytes

Subject

  • Keyword: Density
  • Keyword: Fabrication
  • STI Subject Categories: 36 Materials Science
  • Keyword: Plasma
  • Keyword: Silicon Compounds

Source

  • Conference: 1998 Solid-State Sensor and Actuator Workshop, Hilton Head Island, SC, June 8-11, 1998

Collection

  • Name: Office of Scientific & Technical Information Technical Reports
    Code: OSTI

Institution

  • Name: UNT Libraries Government Documents Department
    Code: UNTGD

Resource Type

  • Article

Format

  • Text

Identifier

  • Other: DE00003405
  • Report No.: UCRL-JC-132467
  • Grant Number: W-7405-Eng-48
  • Office of Scientific & Technical Information Report Number: 3405
  • Archival Resource Key: ark:/67531/metadc685479
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