Fabrication of high-density cantilever arrays and through-wafer interconnects

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Processes to fabricate dense, dry released microstructures with electrical connections on the opposite side of the wafer are described. A 10 x 10 array of silicon and polysilicon cantilevers with high packing density (5 tips/mm<sup>2</sup>) and high uniformity (<10 µm length variation across the wafer) are demonstrated. The cantilever release process uses a deep SF<sub>6</sub>/C<sub>4</sub>F<sub>8</sub>, plasma etch followed by a HBr plasma etch to accurately release cantilevers. A process for fabricating electrical contacts through the backside of the wafer is also described. Electrodeposited resist, conformal CVD metal deposition and deep SF<sub>6</sub>/C<sub>4</sub>F<sub>8</sub> plasma etching are used to make 30 µm/side square ... continued below

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A. Harley, J.; Abdollahi-Alibeik, S.; Chow, E. M.; Kenney, T. W.; McCarthy, A. M.; McVittie, J. P. et al. November 3, 1998.

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Processes to fabricate dense, dry released microstructures with electrical connections on the opposite side of the wafer are described. A 10 x 10 array of silicon and polysilicon cantilevers with high packing density (5 tips/mm<sup>2</sup>) and high uniformity (<10 µm length variation across the wafer) are demonstrated. The cantilever release process uses a deep SF<sub>6</sub>/C<sub>4</sub>F<sub>8</sub>, plasma etch followed by a HBr plasma etch to accurately release cantilevers. A process for fabricating electrical contacts through the backside of the wafer is also described. Electrodeposited resist, conformal CVD metal deposition and deep SF<sub>6</sub>/C<sub>4</sub>F<sub>8</sub> plasma etching are used to make 30 µm/side square vias each of which has a resistance of 50 m(omega).

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597 Kilobytes

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  • 1998 Solid-State Sensor and Actuator Workshop, Hilton Head Island, SC, June 8-11, 1998

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  • Other: DE00003405
  • Report No.: UCRL-JC-132467
  • Grant Number: W-7405-Eng-48
  • Office of Scientific & Technical Information Report Number: 3405
  • Archival Resource Key: ark:/67531/metadc685479

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  • November 3, 1998

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  • July 25, 2015, 2:20 a.m.

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  • May 6, 2016, 9:54 p.m.

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A. Harley, J.; Abdollahi-Alibeik, S.; Chow, E. M.; Kenney, T. W.; McCarthy, A. M.; McVittie, J. P. et al. Fabrication of high-density cantilever arrays and through-wafer interconnects, article, November 3, 1998; Livermore, California. (digital.library.unt.edu/ark:/67531/metadc685479/: accessed November 20, 2017), University of North Texas Libraries, Digital Library, digital.library.unt.edu; crediting UNT Libraries Government Documents Department.