Influence of Surface Material on the BCl Density in Inductively Coupled Discharges

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Description

The relative density of BCl radicals has been measured in a modified Applied Materials DPS metal etch chamber using laser-induced fluorescence. In plasmas containing mixtures of BCl{sub 3} with Cl{sub 2}, Ar and/or N{sub 2}, the relative BCl density was measured as a function of source and bias power, pressure, flow rate, BCl{sub 3}/Cl{sub 2} ratio and argon addition. To determine the influence of surface materials on the bulk plasma properties, the relative BCl density was measured using four different substrate types; aluminum, alumina, photoresist, and photoresist-patterned aluminum. In most cases, the relative BCl density was highest above photoresist-coated wafers ... continued below

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31 p.

Creation Information

Blain, M.G.; Hamilton, T.W. & Hebner, G.A. March 15, 1999.

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This article is part of the collection entitled: Office of Scientific & Technical Information Technical Reports and was provided by UNT Libraries Government Documents Department to Digital Library, a digital repository hosted by the UNT Libraries. More information about this article can be viewed below.

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  • Sandia National Laboratories
    Publisher Info: Sandia National Labs., Albuquerque, NM, and Livermore, CA (United States)
    Place of Publication: Albuquerque, New Mexico

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Description

The relative density of BCl radicals has been measured in a modified Applied Materials DPS metal etch chamber using laser-induced fluorescence. In plasmas containing mixtures of BCl{sub 3} with Cl{sub 2}, Ar and/or N{sub 2}, the relative BCl density was measured as a function of source and bias power, pressure, flow rate, BCl{sub 3}/Cl{sub 2} ratio and argon addition. To determine the influence of surface materials on the bulk plasma properties, the relative BCl density was measured using four different substrate types; aluminum, alumina, photoresist, and photoresist-patterned aluminum. In most cases, the relative BCl density was highest above photoresist-coated wafers and lowest above blanket aluminum wafers. The BCl density increased with increasing source power and the ratio of BCl{sub 3} to Cl{sub 2}, while the addition of N{sub 2} to a BCl{sub 3}/Cl{sub 2} plasma resulted in a decrease in BCl density. The BCl density was relatively insensitive to changes in the other plasma parameters.

Physical Description

31 p.

Notes

OSTI as DE00004330

Medium: P; Size: 31 pages

Source

  • Journal Name: Influence of Surface Material on the BC1 Density in Inductively Coupled Discharges; Other Information: Submitted to Influence of Surface Material on the BC1 Density in Inductively Coupled Discharges

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  • Report No.: SAND99-0607J
  • Grant Number: AC04-94AL85000
  • Office of Scientific & Technical Information Report Number: 4330
  • Archival Resource Key: ark:/67531/metadc685036

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  • March 15, 1999

Added to The UNT Digital Library

  • July 25, 2015, 2:20 a.m.

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  • April 12, 2017, 1:11 p.m.

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Blain, M.G.; Hamilton, T.W. & Hebner, G.A. Influence of Surface Material on the BCl Density in Inductively Coupled Discharges, article, March 15, 1999; Albuquerque, New Mexico. (digital.library.unt.edu/ark:/67531/metadc685036/: accessed September 23, 2017), University of North Texas Libraries, Digital Library, digital.library.unt.edu; crediting UNT Libraries Government Documents Department.