Rapid tooling by electron-beam vapor deposition

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Description

Electron-beam physical vapor deposition (EBPVD) of tooling metal, onto a shaped substrate to produce a replica of the substrate surface, offers the potential for significant cost savings over present methods of injection mold manufacturing. These savings are realized by the high deposition rate and the corresponding short manufacturing times provided by the EBPVD process. However, on route to realizing these gains, there are process technical issues which need to be resolved. Mold surfaces typically contain relatively high aspect ratio details that must be replicated to dimensional tolerances within +/- 2 mils. The deposited mold material must also provide high surface ... continued below

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11 p.

Creation Information

Meier, T. C., LLNL February 25, 1998.

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Description

Electron-beam physical vapor deposition (EBPVD) of tooling metal, onto a shaped substrate to produce a replica of the substrate surface, offers the potential for significant cost savings over present methods of injection mold manufacturing. These savings are realized by the high deposition rate and the corresponding short manufacturing times provided by the EBPVD process. However, on route to realizing these gains, there are process technical issues which need to be resolved. Mold surfaces typically contain relatively high aspect ratio details that must be replicated to dimensional tolerances within +/- 2 mils. The deposited mold material must also provide high surface hardness and high fracture toughness. Good quality grain structure can be obtained in deposited Al 10-wt% Cu mold material when the substrate and corresponding deposit are at high process temperature. However, the resulting mold is subject to distortion during cooldown due to differential temperatures and shrinkage rates. Thermally controlled cooldown and the use of crushable substrate materials reduce these distortions, but not to the required levels of tolerance. Deposition of the Al-Cu at lower temperature produces columnar, poorly joined grains which result in a brittle and weakened mold material. When Al 10-wt% Cu metal vapor is deposited across high aspect ratio step features on the substrate surface, a grain growth defect can form in the step-shadowed regions of the deposited material, alongside the step feature. The step coverage defect consists of entrained voids which persist at intermediate deposition temperatures and produce a weakened mold. This final 1997 LDRD report investigates causes of this step coverage defect and offers methods for their control and elimination.

Physical Description

11 p.

Notes

OSTI as DE98058756

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  • Other Information: PBD: 25 Feb 1998

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  • Other: DE98058756
  • Report No.: UCRL-ID--129943
  • Grant Number: W-7405-ENG-48
  • DOI: 10.2172/301207 | External Link
  • Office of Scientific & Technical Information Report Number: 301207
  • Archival Resource Key: ark:/67531/metadc684611

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  • February 25, 1998

Added to The UNT Digital Library

  • July 25, 2015, 2:20 a.m.

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  • May 8, 2017, 12:46 p.m.

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Meier, T. C., LLNL. Rapid tooling by electron-beam vapor deposition, report, February 25, 1998; California. (digital.library.unt.edu/ark:/67531/metadc684611/: accessed September 22, 2017), University of North Texas Libraries, Digital Library, digital.library.unt.edu; crediting UNT Libraries Government Documents Department.