A novel method to characterize the elastic/plastic deformation response of thin films

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Description

A novel experimental/numerical test method has been developed which allows accurate characterization of the elastic and large-strain plastic mechanical response of thin films. Silicon micromachining techniques have been used to fabricate isolated film features which are mechanically tested using our ultralow-load indentation test system. Macro-scale laboratory testing and finite element analysis were employed to optimize the design of the geometric feature used and to benchmark our analysis capabilities. A simple rigid-plastic geometric analysis of our test structure is developed and applied to the observed force-displacement response, allowing us to extract the uniaxial inelastic stress-strain response of micrometer-scale thin film structures. ... continued below

Physical Description

32 p.

Creation Information

Bourcier, R.J.; Sniegowski, J.J. & Porter, V.L. July 1, 1996.

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This report is part of the collection entitled: Office of Scientific & Technical Information Technical Reports and was provided by UNT Libraries Government Documents Department to Digital Library, a digital repository hosted by the UNT Libraries. It has been viewed 17 times . More information about this report can be viewed below.

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  • Sandia National Laboratories
    Publisher Info: Sandia National Labs., Albuquerque, NM (United States)
    Place of Publication: Albuquerque, New Mexico

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Description

A novel experimental/numerical test method has been developed which allows accurate characterization of the elastic and large-strain plastic mechanical response of thin films. Silicon micromachining techniques have been used to fabricate isolated film features which are mechanically tested using our ultralow-load indentation test system. Macro-scale laboratory testing and finite element analysis were employed to optimize the design of the geometric feature used and to benchmark our analysis capabilities. A simple rigid-plastic geometric analysis of our test structure is developed and applied to the observed force-displacement response, allowing us to extract the uniaxial inelastic stress-strain response of micrometer-scale thin film structures. To our knowledge, this is the first time that the inelastic deformation behavior of metal alloy features of this size scale has been quantitatively determined.

Physical Description

32 p.

Notes

OSTI as DE97000569

Source

  • Other Information: PBD: Jul 1996

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  • Other: DE97000569
  • Report No.: SAND--96-1794
  • Grant Number: AC04-94AL85000
  • DOI: 10.2172/399701 | External Link
  • Office of Scientific & Technical Information Report Number: 399701
  • Archival Resource Key: ark:/67531/metadc683179

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Office of Scientific & Technical Information Technical Reports

Reports, articles and other documents harvested from the Office of Scientific and Technical Information.

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Creation Date

  • July 1, 1996

Added to The UNT Digital Library

  • July 25, 2015, 2:20 a.m.

Description Last Updated

  • April 13, 2016, 4:05 p.m.

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Bourcier, R.J.; Sniegowski, J.J. & Porter, V.L. A novel method to characterize the elastic/plastic deformation response of thin films, report, July 1, 1996; Albuquerque, New Mexico. (digital.library.unt.edu/ark:/67531/metadc683179/: accessed April 21, 2018), University of North Texas Libraries, Digital Library, digital.library.unt.edu; crediting UNT Libraries Government Documents Department.