A Batch Wafer Scale LIGA Assembly and Packaging Technique vai Diffusion Bonding Metadata

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  • Main Title A Batch Wafer Scale LIGA Assembly and Packaging Technique vai Diffusion Bonding


  • Author: Christenson, T.R.
    Creator Type: Personal
  • Author: Schmale, D.T.
    Creator Type: Personal


  • Sponsor: United States. Department of Energy.
    Contributor Type: Organization


  • Name: Sandia National Laboratories
    Place of Publication: Albuquerque, New Mexico
    Additional Info: Sandia National Laboratories, Albuquerque, NM, and Livermore, CA


  • Creation: 1999-01-27


  • English


  • Content Description: A technique using diffusion bonding (or solid-state welding) has been used to achieve batch fabrication of two- level nickel LIGA structures. Interlayer alignment accuracy of less than 1 micron is achieved using press-fit gauge pins. A mini-scale torsion tester was built to measure the diffusion bond strength of LIGA formed specimens that has shown successful bonding at temperatures of 450"C at 7 ksi pressure with bond strength greater than 100 Mpa. Extensions to this basic process to allow for additional layers and thereby more complex assemblies as well as commensurate packaging are discussed.


  • STI Subject Categories: 36 Materials Science
  • Keyword: Diffusion Welding
  • Keyword: Nickel
  • Keyword: Bonding


  • Conference: IEEE International MEMS '99 Conference; Orlando, FL; 01/17-21/1999


  • Name: Office of Scientific & Technical Information Technical Reports
    Code: OSTI


  • Name: UNT Libraries Government Documents Department
    Code: UNTGD

Resource Type

  • Article


  • Text


  • Other: DE00003305
  • Report No.: SAND99-0229C
  • Grant Number: AC04-94AL85000
  • Office of Scientific & Technical Information Report Number: 3305
  • Archival Resource Key: ark:/67531/metadc681650