A Batch Wafer Scale LIGA Assembly and Packaging Technique vai Diffusion Bonding Metadata

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Title

  • Main Title A Batch Wafer Scale LIGA Assembly and Packaging Technique vai Diffusion Bonding

Creator

  • Author: Christenson, T.R.
    Creator Type: Personal
  • Author: Schmale, D.T.
    Creator Type: Personal

Contributor

  • Sponsor: United States. Department of Energy.
    Contributor Type: Organization

Publisher

  • Name: Sandia National Laboratories
    Place of Publication: Albuquerque, New Mexico
    Additional Info: Sandia National Laboratories, Albuquerque, NM, and Livermore, CA

Date

  • Creation: 1999-01-27

Language

  • English

Description

  • Content Description: A technique using diffusion bonding (or solid-state welding) has been used to achieve batch fabrication of two- level nickel LIGA structures. Interlayer alignment accuracy of less than 1 micron is achieved using press-fit gauge pins. A mini-scale torsion tester was built to measure the diffusion bond strength of LIGA formed specimens that has shown successful bonding at temperatures of 450"C at 7 ksi pressure with bond strength greater than 100 Mpa. Extensions to this basic process to allow for additional layers and thereby more complex assemblies as well as commensurate packaging are discussed.

Subject

  • STI Subject Categories: 36 Materials Science
  • Keyword: Diffusion Welding
  • Keyword: Nickel
  • Keyword: Bonding

Source

  • Conference: IEEE International MEMS '99 Conference; Orlando, FL; 01/17-21/1999

Collection

  • Name: Office of Scientific & Technical Information Technical Reports
    Code: OSTI

Institution

  • Name: UNT Libraries Government Documents Department
    Code: UNTGD

Resource Type

  • Article

Format

  • Text

Identifier

  • Other: DE00003305
  • Report No.: SAND99-0229C
  • Grant Number: AC04-94AL85000
  • Office of Scientific & Technical Information Report Number: 3305
  • Archival Resource Key: ark:/67531/metadc681650