Christenson, T.R. & Schmale, D.T. A Batch Wafer Scale LIGA Assembly and Packaging Technique vai Diffusion Bonding, article, January 27, 1999; (https://digital.library.unt.edu/ark:/67531/metadc681650/m1/1/: accessed April 21, 2019), University of North Texas Libraries, Digital Library, digital.library.unt.edu; .