A Batch Wafer Scale LIGA Assembly and Packaging Technique vai Diffusion Bonding

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Description

A technique using diffusion bonding (or solid-state welding) has been used to achieve batch fabrication of two- level nickel LIGA structures. Interlayer alignment accuracy of less than 1 micron is achieved using press-fit gauge pins. A mini-scale torsion tester was built to measure the diffusion bond strength of LIGA formed specimens that has shown successful bonding at temperatures of 450"C at 7 ksi pressure with bond strength greater than 100 Mpa. Extensions to this basic process to allow for additional layers and thereby more complex assemblies as well as commensurate packaging are discussed.

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Christenson, T.R. & Schmale, D.T. January 27, 1999.

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This article is part of the collection entitled: Office of Scientific & Technical Information Technical Reports and was provided by UNT Libraries Government Documents Department to Digital Library, a digital repository hosted by the UNT Libraries. It has been viewed 57 times , with 6 in the last month . More information about this article can be viewed below.

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  • Sandia National Laboratories
    Publisher Info: Sandia National Laboratories, Albuquerque, NM, and Livermore, CA
    Place of Publication: Albuquerque, New Mexico

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Description

A technique using diffusion bonding (or solid-state welding) has been used to achieve batch fabrication of two- level nickel LIGA structures. Interlayer alignment accuracy of less than 1 micron is achieved using press-fit gauge pins. A mini-scale torsion tester was built to measure the diffusion bond strength of LIGA formed specimens that has shown successful bonding at temperatures of 450"C at 7 ksi pressure with bond strength greater than 100 Mpa. Extensions to this basic process to allow for additional layers and thereby more complex assemblies as well as commensurate packaging are discussed.

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  • IEEE International MEMS '99 Conference; Orlando, FL; 01/17-21/1999

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  • Other: DE00003305
  • Report No.: SAND99-0229C
  • Grant Number: AC04-94AL85000
  • Office of Scientific & Technical Information Report Number: 3305
  • Archival Resource Key: ark:/67531/metadc681650

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Office of Scientific & Technical Information Technical Reports

Reports, articles and other documents harvested from the Office of Scientific and Technical Information.

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Creation Date

  • January 27, 1999

Added to The UNT Digital Library

  • July 25, 2015, 2:20 a.m.

Description Last Updated

  • Nov. 22, 2016, 9:07 p.m.

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Christenson, T.R. & Schmale, D.T. A Batch Wafer Scale LIGA Assembly and Packaging Technique vai Diffusion Bonding, article, January 27, 1999; Albuquerque, New Mexico. (digital.library.unt.edu/ark:/67531/metadc681650/: accessed November 16, 2018), University of North Texas Libraries, Digital Library, digital.library.unt.edu; crediting UNT Libraries Government Documents Department.