Design and Testing of Metal and Silicon Heat Spreaders with Embedded Micromachined Heat Pipes

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The authors have developed a new type of heat spreader based on the integration of heat pipes directly within a thin planar structure suitable for use as a heat spreader or as the base layer in a substrate. The process uses micromachining methods to produce micron scale patterns that act as a wick in these small scale heat pipes. By using silicon or a low expansion metal as the wall material of these spreaders, they achieve a good match to the thermal coefficient of expansion of the die. The match allows the use of a thin high performance die attachment ... continued below

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10 p.

Creation Information

Benson, D.A. & Robino, C.V. February 22, 1999.

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This article is part of the collection entitled: Office of Scientific & Technical Information Technical Reports and was provided by UNT Libraries Government Documents Department to Digital Library, a digital repository hosted by the UNT Libraries. It has been viewed 13 times . More information about this article can be viewed below.

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  • Sandia National Laboratories
    Publisher Info: Sandia National Labs., Albuquerque, NM, and Livermore, CA
    Place of Publication: Albuquerque, New Mexico

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Description

The authors have developed a new type of heat spreader based on the integration of heat pipes directly within a thin planar structure suitable for use as a heat spreader or as the base layer in a substrate. The process uses micromachining methods to produce micron scale patterns that act as a wick in these small scale heat pipes. By using silicon or a low expansion metal as the wall material of these spreaders, they achieve a good match to the thermal coefficient of expansion of the die. The match allows the use of a thin high performance die attachment even on large size die. The embedded heat pipes result in high effective thermal conductivity for the new spreader technology.

Physical Description

10 p.

Notes

OSTI as DE00003878

Medium: P; Size: 10 pages

Source

  • InterPACK'99 Conference, Maui, HI (US), 06/13/1999--06/19/1999

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  • Report No.: SAND99-0459C
  • Grant Number: AC04-94AL85000
  • Office of Scientific & Technical Information Report Number: 3878
  • Archival Resource Key: ark:/67531/metadc680910

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Office of Scientific & Technical Information Technical Reports

Reports, articles and other documents harvested from the Office of Scientific and Technical Information.

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Creation Date

  • February 22, 1999

Added to The UNT Digital Library

  • July 25, 2015, 2:20 a.m.

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  • April 6, 2017, 6:41 p.m.

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Benson, D.A. & Robino, C.V. Design and Testing of Metal and Silicon Heat Spreaders with Embedded Micromachined Heat Pipes, article, February 22, 1999; Albuquerque, New Mexico. (digital.library.unt.edu/ark:/67531/metadc680910/: accessed July 16, 2018), University of North Texas Libraries, Digital Library, digital.library.unt.edu; crediting UNT Libraries Government Documents Department.