Laser ablative cutting of ceramics for electronics applications

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Description

Pulsed, high-beam quality lasers offer unique materials processing characteristics. In processing metals, copper vapor and pulsed Nd:YAG lasers have produced micron-scale cuts and holes with submicron heat-affected zones. Since the cost of laser photons is high and average material removal rates can be slow with ablation, high value-added applications are necessary to justify processing costs. Ceramics present a special challenge for manufacturing because of their high hardness, relatively low thermal conductivity, and brittle nature. Surface damage typically limits the strength of a ceramic part to a small fraction of its bulk strength. This work investigates the use of copper vapor ... continued below

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18 p.

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Warner, B. E. March 1, 1996.

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Description

Pulsed, high-beam quality lasers offer unique materials processing characteristics. In processing metals, copper vapor and pulsed Nd:YAG lasers have produced micron-scale cuts and holes with submicron heat-affected zones. Since the cost of laser photons is high and average material removal rates can be slow with ablation, high value-added applications are necessary to justify processing costs. Ceramics present a special challenge for manufacturing because of their high hardness, relatively low thermal conductivity, and brittle nature. Surface damage typically limits the strength of a ceramic part to a small fraction of its bulk strength. This work investigates the use of copper vapor and pulsed diode-pumped Nd:YAG lasers to cut precision features in ceramic substrates. Variations in laser wavelength and power, processing speed, ceramic type, and assist gas were investigated with the goal of producing <100-{mu}m wide by 600-{mu}m deep cuts through silicon-carbide and alumina/titanium-carbide substrates for potential use in electronics. Silicon-carbide bars 250-{mu}m wide by 600-{mu}m high by 2.5-cm long were laser cut from substrates without fracture.

Physical Description

18 p.

Notes

OSTI as DE98054505

Other: FDE: PDF; PL:

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  • Other Information: PBD: Mar 1996

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  • Other: DE98054505
  • Report No.: UCRL-ID--123677
  • Grant Number: W-7405-ENG-48
  • DOI: 10.2172/324973 | External Link
  • Office of Scientific & Technical Information Report Number: 324973
  • Archival Resource Key: ark:/67531/metadc680596

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Office of Scientific & Technical Information Technical Reports

Reports, articles and other documents harvested from the Office of Scientific and Technical Information.

Office of Scientific and Technical Information (OSTI) is the Department of Energy (DOE) office that collects, preserves, and disseminates DOE-sponsored research and development (R&D) results that are the outcomes of R&D projects or other funded activities at DOE labs and facilities nationwide and grantees at universities and other institutions.

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  • March 1, 1996

Added to The UNT Digital Library

  • July 25, 2015, 2:20 a.m.

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  • April 10, 2017, 2:23 p.m.

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Warner, B. E. Laser ablative cutting of ceramics for electronics applications, report, March 1, 1996; California. (digital.library.unt.edu/ark:/67531/metadc680596/: accessed December 13, 2017), University of North Texas Libraries, Digital Library, digital.library.unt.edu; crediting UNT Libraries Government Documents Department.