A comparison of chilled DI water/ozone and CO{sub 2}-based supercritical fluids as replacements for photoresist-stripping solvents

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Part of the Hewlett Packard Components Group`s Product Stewardship program is the ongoing effort to investigate ways to eliminate or reduce as much as possible the use of chemical substances from manufacturing processes. Currently used techniques to remove hard-baked photoresists from semiconductor wafers require the use of inorganic chemicals or organic strippers and associated organic solvents. Environmental, health and safety, as well as cost considerations prompted the search for alternative, more environmentally-benign, and cost-effective solutions. Two promising, emerging technologies were selected for evaluation: the chilled DI water/ozone technique and supercritical fluids based on carbon dioxide (CO{sub 2}). Evaluating chilled DI ... continued below

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8 p.

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Rubin, J. B.; Davenhall, L. B.; Barton, J.; Taylor, C. M. V. & Tiefert, K. October 1998.

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  • Los Alamos National Laboratory
    Publisher Info: Los Alamos National Lab., Chemical Science and Technology Div., NM (United States)
    Place of Publication: New Mexico

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Description

Part of the Hewlett Packard Components Group`s Product Stewardship program is the ongoing effort to investigate ways to eliminate or reduce as much as possible the use of chemical substances from manufacturing processes. Currently used techniques to remove hard-baked photoresists from semiconductor wafers require the use of inorganic chemicals or organic strippers and associated organic solvents. Environmental, health and safety, as well as cost considerations prompted the search for alternative, more environmentally-benign, and cost-effective solutions. Two promising, emerging technologies were selected for evaluation: the chilled DI water/ozone technique and supercritical fluids based on carbon dioxide (CO{sub 2}). Evaluating chilled DI water/ozone shows this process to be effective for positive photoresist removal, but may not be compatible with all metallization systems. Testing of a closed-loop CO{sub 2}-based supercritical CO{sub 2} Resist Remover, or SCORR, at Los Alamos, on behalf of Hewlett-packard, shows that this treatment process is effective in removing photoresists, and is fully compatible with commonly used metallization systems. In this paper, the authors present details on the testing programs conducted with both the chilled DI H{sub 2}O/ozone and SCORR treatment processes.

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8 p.

Notes

OSTI as DE99002595

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  • 23. international electronics manufacturing technology symposium, Austin, TX (United States), 20-22 Oct 1998

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  • Other: DE99002595
  • Report No.: LA-UR--98-3476
  • Report No.: CONF-9810140--
  • Grant Number: W-7405-ENG-36
  • Office of Scientific & Technical Information Report Number: 353176
  • Archival Resource Key: ark:/67531/metadc678471

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Office of Scientific & Technical Information Technical Reports

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  • October 1998

Added to The UNT Digital Library

  • July 25, 2015, 2:20 a.m.

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  • Nov. 3, 2016, 1:28 p.m.

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Rubin, J. B.; Davenhall, L. B.; Barton, J.; Taylor, C. M. V. & Tiefert, K. A comparison of chilled DI water/ozone and CO{sub 2}-based supercritical fluids as replacements for photoresist-stripping solvents, article, October 1998; New Mexico. (digital.library.unt.edu/ark:/67531/metadc678471/: accessed December 11, 2017), University of North Texas Libraries, Digital Library, digital.library.unt.edu; crediting UNT Libraries Government Documents Department.