Organic solderability preservation evaluation. Topical report

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Description

An evaluation was conducted to determine the possible replacement of the hot air solder leveling (HASL) process used in the Allied Signal Federal Manufacturing & Technologies (FM&T) Printed Wiring Board Facility with an organic solderability preservative (OSP). The drivers for replacing HASL include (1) Eliminating lead from PWB fabrication processes; (2) Potential legislation restricting use of lead, (3) Less expensive processing utilizing OSP rather than HASL processing; (4) Avoiding solder dross disposal inherent with HASL processing, (5) OSP provides flat, planar surface required for surface mount technology product, and (6) Trend to thinner PWB designs. A reduction in the cost ... continued below

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27 p.

Creation Information

Becka, G.A.; McHenry, M.R. & Slanina, J.T. March 1, 1997.

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Description

An evaluation was conducted to determine the possible replacement of the hot air solder leveling (HASL) process used in the Allied Signal Federal Manufacturing & Technologies (FM&T) Printed Wiring Board Facility with an organic solderability preservative (OSP). The drivers for replacing HASL include (1) Eliminating lead from PWB fabrication processes; (2) Potential legislation restricting use of lead, (3) Less expensive processing utilizing OSP rather than HASL processing; (4) Avoiding solder dross disposal inherent with HASL processing, (5) OSP provides flat, planar surface required for surface mount technology product, and (6) Trend to thinner PWB designs. A reduction in the cost of nonconformance (CONC) due to HASL defects (exposed copper, solderability, dewetting and non-wetting) would be realized with the incorporation of the OSP process. Several supplier HASL replacement candidates were initially evaluated. One supplier chemistry was chosen for potential use in the FM&T PWB and assembly areas.

Physical Description

27 p.

Notes

OSTI as DE97052917

Source

  • Other Information: PBD: Mar 1997

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  • Other: DE97052917
  • Report No.: KCP--613-5885
  • Grant Number: AC04-76DP00613
  • DOI: 10.2172/491375 | External Link
  • Office of Scientific & Technical Information Report Number: 491375
  • Archival Resource Key: ark:/67531/metadc677825

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Office of Scientific & Technical Information Technical Reports

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Creation Date

  • March 1, 1997

Added to The UNT Digital Library

  • July 25, 2015, 2:21 a.m.

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  • Nov. 24, 2015, 6:48 p.m.

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Becka, G.A.; McHenry, M.R. & Slanina, J.T. Organic solderability preservation evaluation. Topical report, report, March 1, 1997; United States. (digital.library.unt.edu/ark:/67531/metadc677825/: accessed August 17, 2017), University of North Texas Libraries, Digital Library, digital.library.unt.edu; crediting UNT Libraries Government Documents Department.