Materials property testing using a stress-strain microprobe

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Description

The Stress-Strain Microprobe (SSM) uses an automated ball indentation technique to obtain flow data from a localized region of a test specimen or component. This technique is used to rapidly determine the yield strength and microstructural condition of a variety of materials including pressure vessel steels, stainless steels, and nickel-base alloys. The SSM provides an essentially non-destructive technique for the measurement of yield strength data. This technique is especially suitable for the study of complex or highly variable microstructures such as weldments and weld heat affected zones. In this study 119 distinct SSM determinations of the yield strength of eight ... continued below

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14 p.

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Panayotou, N.F.; Baldrey, D.G. & Haggag, F.M. September 1, 1998.

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This report is part of the collection entitled: Office of Scientific & Technical Information Technical Reports and was provided by UNT Libraries Government Documents Department to Digital Library, a digital repository hosted by the UNT Libraries. It has been viewed 12 times . More information about this report can be viewed below.

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  • Knolls Atomic Power Laboratory
    Publisher Info: Knolls Atomic Power Lab., Schenectady, NY (United States)
    Place of Publication: Schenectady, New York

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Description

The Stress-Strain Microprobe (SSM) uses an automated ball indentation technique to obtain flow data from a localized region of a test specimen or component. This technique is used to rapidly determine the yield strength and microstructural condition of a variety of materials including pressure vessel steels, stainless steels, and nickel-base alloys. The SSM provides an essentially non-destructive technique for the measurement of yield strength data. This technique is especially suitable for the study of complex or highly variable microstructures such as weldments and weld heat affected zones. In this study 119 distinct SSM determinations of the yield strength of eight engineering alloys are discussed and compared to data obtained by conventional tensile tests. The sensitivity of the SSM to the presence of residual stresses is also discussed.

Physical Description

14 p.

Notes

INIS; OSTI as DE99001978

Source

  • Materials Week `97, Indianapolis, IN (United States), 14-18 Sep 1997

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  • Other: DE99001978
  • Report No.: KAPL-P--000189
  • Report No.: CONF-970980--;K--97105
  • Grant Number: AC12-76SN00052
  • DOI: 10.2172/350966 | External Link
  • Office of Scientific & Technical Information Report Number: 350966
  • Archival Resource Key: ark:/67531/metadc677342

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Reports, articles and other documents harvested from the Office of Scientific and Technical Information.

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Creation Date

  • September 1, 1998

Added to The UNT Digital Library

  • July 25, 2015, 2:20 a.m.

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  • May 16, 2016, 4:56 p.m.

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Panayotou, N.F.; Baldrey, D.G. & Haggag, F.M. Materials property testing using a stress-strain microprobe, report, September 1, 1998; Schenectady, New York. (digital.library.unt.edu/ark:/67531/metadc677342/: accessed September 21, 2018), University of North Texas Libraries, Digital Library, digital.library.unt.edu; crediting UNT Libraries Government Documents Department.