Assessment of circuit board surface finishes for electronic assembly with lead-free solders

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Description

The suitability of various metallic printed wiring board surface finishes was assessed for new technology applications that incorporate assembly with Lead-free solders. The manufacture of a lead-free product necessitates elimination of lead (Pb) from the solder, the circuit board as well as the component lead termination. It is critical however for the selected interconnect Pb-free solder and the corresponding printed wiring board (PWB) and component lead finishes to be mutually compatible. Baseline compatibility of select Pb-free solders with Pb containing PWB surface finish and components was assessed. This was followed by examining the compatibility of the commercially available CASTIN{trademark} (SnAgCuSb) ... continued below

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14 p.

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Ray, U.; Artaki, I.; Finley, D. W.; Wenger, G. M.; Pan, T.; Blair, H. D. et al. October 1, 1996.

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  • Sandia National Laboratories
    Publisher Info: Sandia National Labs., Albuquerque, NM (United States)
    Place of Publication: Albuquerque, New Mexico

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Description

The suitability of various metallic printed wiring board surface finishes was assessed for new technology applications that incorporate assembly with Lead-free solders. The manufacture of a lead-free product necessitates elimination of lead (Pb) from the solder, the circuit board as well as the component lead termination. It is critical however for the selected interconnect Pb-free solder and the corresponding printed wiring board (PWB) and component lead finishes to be mutually compatible. Baseline compatibility of select Pb-free solders with Pb containing PWB surface finish and components was assessed. This was followed by examining the compatibility of the commercially available CASTIN{trademark} (SnAgCuSb) Pb-free solder with a series of PWB metallic finishes: Ni/Au, Ni/Pd, and Pd/Cu. The compatibility was assessed with respect to assembly performance, solder joint integrity and long term attachment reliability. Solder joint integrity and mechanical behavior of representative 50 mil pitch 20I/O SOICs was determined before and after thermal stress. Mechanical pull test studies demonstrated that the strength of SnAgCuSb solder interconnections is notably greater than that of SnPb interconnections.

Physical Description

14 p.

Notes

OSTI as DE96014884

Source

  • Surface Mount International: advanced electronics manufacturing technologies, San Jose, CA (United States), 3-12 Sep 1996

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  • Other: DE96014884
  • Report No.: SAND--96-2265C
  • Report No.: CONF-9609212--4
  • Grant Number: AC04-94AL85000
  • Office of Scientific & Technical Information Report Number: 378903
  • Archival Resource Key: ark:/67531/metadc677312

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Office of Scientific & Technical Information Technical Reports

Reports, articles and other documents harvested from the Office of Scientific and Technical Information.

Office of Scientific and Technical Information (OSTI) is the Department of Energy (DOE) office that collects, preserves, and disseminates DOE-sponsored research and development (R&D) results that are the outcomes of R&D projects or other funded activities at DOE labs and facilities nationwide and grantees at universities and other institutions.

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Creation Date

  • October 1, 1996

Added to The UNT Digital Library

  • July 25, 2015, 2:20 a.m.

Description Last Updated

  • April 13, 2016, 12:56 p.m.

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Ray, U.; Artaki, I.; Finley, D. W.; Wenger, G. M.; Pan, T.; Blair, H. D. et al. Assessment of circuit board surface finishes for electronic assembly with lead-free solders, article, October 1, 1996; Albuquerque, New Mexico. (digital.library.unt.edu/ark:/67531/metadc677312/: accessed November 18, 2017), University of North Texas Libraries, Digital Library, digital.library.unt.edu; crediting UNT Libraries Government Documents Department.