Development work on a new package design for the next generation microelectronics. Final report Page: 1 of 13
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Development Work on a New Package Design
for the Next Generation Microelectronics
Federal Manufacturing & Technologies
B. E. Adams, FM&T, and
V. DeMarco, Micro-Mode Products
Published November 1996
Approved for public release; distribution is unlimited.
Il10 ml3d4 JIN OF THIS DOCUMENT IS UNLWM17
Prepared Under Contract Number DE-AC04-76-DPOO613 for the
United States Department of Energy
MAST Ef M.
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Adams, B.E. & DeMarco, V. Development work on a new package design for the next generation microelectronics. Final report, report, November 1, 1996; United States. (digital.library.unt.edu/ark:/67531/metadc675900/m1/1/: accessed November 19, 2018), University of North Texas Libraries, Digital Library, digital.library.unt.edu; crediting UNT Libraries Government Documents Department.