Development work on a new package design for the next generation microelectronics. Final report

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Description

AlliedSignal and Micro-Mode Products joined under a DOE CRADA to develop a new package for next-generation electronics devices. Requirements included low cost of manufacture, ability to satisfy thermal expansion requirements, ability to satisfy thermal dissipation requirements, acceptable digital and microwave performance, and hermeticity. Four processes were tested; vacuum deposition of paralene, epoxy powder coating, transfer molding, and manual encapsulation. Transfer molding and manual potting improved the hermeticity but produced microcracking and reduced heat transfer ability following encapsulation. Additional study on manufacturing and encapsulating of the package is needed.

Physical Description

12 p.

Creation Information

Adams, B.E. & DeMarco, V. November 1, 1996.

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This report is part of the collection entitled: Office of Scientific & Technical Information Technical Reports and was provided by UNT Libraries Government Documents Department to Digital Library, a digital repository hosted by the UNT Libraries. More information about this report can be viewed below.

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Authors

  • Adams, B.E. AlliedSignal, Inc., Kansas City, MO (United States). Federal Mfg. and Technologies
  • DeMarco, V. Micro-Mode Products, Inc., El Cajon, CA (United States)

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Description

AlliedSignal and Micro-Mode Products joined under a DOE CRADA to develop a new package for next-generation electronics devices. Requirements included low cost of manufacture, ability to satisfy thermal expansion requirements, ability to satisfy thermal dissipation requirements, acceptable digital and microwave performance, and hermeticity. Four processes were tested; vacuum deposition of paralene, epoxy powder coating, transfer molding, and manual encapsulation. Transfer molding and manual potting improved the hermeticity but produced microcracking and reduced heat transfer ability following encapsulation. Additional study on manufacturing and encapsulating of the package is needed.

Physical Description

12 p.

Notes

OSTI as DE97050575

Source

  • Other Information: PBD: Nov 1996

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Identifier

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  • Other: DE97050575
  • Report No.: KCP--613-5853
  • Grant Number: AC04-76DP00613
  • DOI: 10.2172/414576 | External Link
  • Office of Scientific & Technical Information Report Number: 414576
  • Archival Resource Key: ark:/67531/metadc675900

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Office of Scientific & Technical Information Technical Reports

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Creation Date

  • November 1, 1996

Added to The UNT Digital Library

  • July 25, 2015, 2:20 a.m.

Description Last Updated

  • Dec. 7, 2015, 12:19 p.m.

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Citations, Rights, Re-Use

Adams, B.E. & DeMarco, V. Development work on a new package design for the next generation microelectronics. Final report, report, November 1, 1996; United States. (digital.library.unt.edu/ark:/67531/metadc675900/: accessed September 25, 2017), University of North Texas Libraries, Digital Library, digital.library.unt.edu; crediting UNT Libraries Government Documents Department.