Development of a micropump for microelectronic cooling

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To demonstrate a system integration process for Micro-Electro-Mechanical Systems (MEMS), we are building an active cooling MEMS unit for microelectronics applications. This integrated unit will incorporate a micropump, temperature sensors, microchannels, and heat exchange devices into a single unit. The first phase of this research project is to develop and test a micropump capable of moving the working fluid within the integrated device. This paper will discuss the design, development, testing, and evaluation of a micropump concept. The micropump which was developed is an electrohydrodynamic (EHD) injection pump. Fabrication of the pump was accomplished using laser micromachining technology, and two ... continued below

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6 p.

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Wong, C.C.; Adkins, D.R. & Chu, Dahwey October 1, 1996.

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  • Sandia National Laboratories
    Publisher Info: Sandia National Labs., Albuquerque, NM (United States)
    Place of Publication: Albuquerque, New Mexico

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Description

To demonstrate a system integration process for Micro-Electro-Mechanical Systems (MEMS), we are building an active cooling MEMS unit for microelectronics applications. This integrated unit will incorporate a micropump, temperature sensors, microchannels, and heat exchange devices into a single unit. The first phase of this research project is to develop and test a micropump capable of moving the working fluid within the integrated device. This paper will discuss the design, development, testing, and evaluation of a micropump concept. The micropump which was developed is an electrohydrodynamic (EHD) injection pump. Fabrication of the pump was accomplished using laser micromachining technology, and two initial designs were examined for full fabrication. The first design has two silicon parts stacked vertically on top of each other. Gold is deposited on one side of each stacked plate to serve as electrodes for the electrohydrodynamic pump. A Nd:YAG laser is used to drill an array of circular holes in the {open_quotes}well{close_quotes} region of both silicon parts, leaving an open pathway for fluid movement. Next the silicon parts are aligned and bonded together, thus becoming a EHD pump. Fluid flow has been observed when an electric voltage is applied across the electrodes. The second design has the silicon parts which contain the flow grid oriented {open_quotes}back-to-back{close_quotes} and bonded together. This {open_quotes}back-to-back{close_quotes} design has a shorter grid distance between the anode and cathode plates so that a smaller voltage is required for pumping. Preliminary results from laboratory experiments have demonstrated that this EHD micropump design can achieve a pressure head of about 287 Pa with an applied voltage of 120 V.

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6 p.

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OSTI as DE96014081

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  • 1996 international mechanical engineering congress and exhibition, Atlanta, GA (United States), 17-22 Nov 1996

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  • Other: DE96014081
  • Report No.: SAND--96-2045C
  • Report No.: CONF-961105--11
  • Grant Number: AC04-94AL85000
  • Office of Scientific & Technical Information Report Number: 385561
  • Archival Resource Key: ark:/67531/metadc675640

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  • October 1, 1996

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  • July 25, 2015, 2:20 a.m.

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  • April 14, 2016, 8:23 p.m.

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Wong, C.C.; Adkins, D.R. & Chu, Dahwey. Development of a micropump for microelectronic cooling, article, October 1, 1996; Albuquerque, New Mexico. (digital.library.unt.edu/ark:/67531/metadc675640/: accessed September 25, 2018), University of North Texas Libraries, Digital Library, digital.library.unt.edu; crediting UNT Libraries Government Documents Department.