Hazards and controls at the Sandia National Laboratories microelectronics development laboratory

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The Microelectronics Development Laboratory (MDL) contains 3,000 m{sup 2}, Which includes 1,000 m{sup 2}of Class I clean room space. There are 20 laminar flow Class I clean room bays. The MDL supplies several, full-flow process technologies which produce complementary metal oxide semiconductor (CMOS) integrated circuits using 150 nun diameter silicon wafers. All gases, chemicals and physical hazards used in the fabrication processes are controlled to levels well below regulatory requirements. Facility engineering controls in the MDL include toxic and pyrophoric gas monitoring, interlocks, ventilation, substitution and chemical segregation. Toxic and pyrophoric gases are monitored continuously inside processing tools as well ... continued below

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5 p.

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Benton, M.A. March 1, 1997.

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  • Sandia National Laboratories
    Publisher Info: Sandia National Labs., Albuquerque, NM (United States)
    Place of Publication: Albuquerque, New Mexico

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Description

The Microelectronics Development Laboratory (MDL) contains 3,000 m{sup 2}, Which includes 1,000 m{sup 2}of Class I clean room space. There are 20 laminar flow Class I clean room bays. The MDL supplies several, full-flow process technologies which produce complementary metal oxide semiconductor (CMOS) integrated circuits using 150 nun diameter silicon wafers. All gases, chemicals and physical hazards used in the fabrication processes are controlled to levels well below regulatory requirements. Facility engineering controls in the MDL include toxic and pyrophoric gas monitoring, interlocks, ventilation, substitution and chemical segregation. Toxic and pyrophoric gases are monitored continuously inside processing tools as well as through the exhaust lines, gas cabinets, the valve boxes, and in general work areas. The toxic gas monitoring systems are interlocked to gas shutoff valves and have both low and high level alarms. In-use process gases are stored in exhausted cabinets. All chemicals and gases are segregated by chemical type. The processes are organized into eight sector areas that consist of photolithography, wet processes, dry etch, ion implant, metals, diffusion, chemical vapor deposition (CVD) and chemical mechanical polishing (CW). Each morning, engineering, safety and facilities personnel meet to review the equipment and wafer lot status and discuss processing issues. Hazards are assessed in the MDL with periodic walkthroughs, continuous toxic and pyrophoric gas monitoring and personal monitoring. All chemicals and gases proposed for use in the MDL are reviewed by the industrial hygienist and must be approved by a manager before they are purchased. All new equipment and processes are reviewed by a hazard and barrier committee and cannot be used in the MDL without the committee`s approval and an IH hazard assessment. Overall risk of operating the MDL has been reduced to a level that is as low as reasonable achievable for this research facility.

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5 p.

Notes

OSTI as DE97002535

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  • 1997 Semiconductor Safety Association annual conference, Orlalndo, FL (United States), 1-4 Apr 1997

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  • Other: DE97002535
  • Report No.: SAND--97-0242C
  • Report No.: CONF-970474--1
  • Grant Number: AC04-94AL85000
  • Office of Scientific & Technical Information Report Number: 462891
  • Archival Resource Key: ark:/67531/metadc675631

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Office of Scientific & Technical Information Technical Reports

Reports, articles and other documents harvested from the Office of Scientific and Technical Information.

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  • March 1, 1997

Added to The UNT Digital Library

  • July 25, 2015, 2:21 a.m.

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  • April 14, 2016, 4 p.m.

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Benton, M.A. Hazards and controls at the Sandia National Laboratories microelectronics development laboratory, article, March 1, 1997; Albuquerque, New Mexico. (digital.library.unt.edu/ark:/67531/metadc675631/: accessed November 16, 2018), University of North Texas Libraries, Digital Library, digital.library.unt.edu; crediting UNT Libraries Government Documents Department.