Life prediction modeling of solder interconnects for electronic systems

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Description

A microstructurally-based computational simulation is presented that predicts the behavior and lifetime of solder interconnects for electronic applications. This finite element simulation is based on an internal state variable constitutive model that captures both creep and plasticity, and accounts for microstructural evolution. The basis of the microstructural evolution is a simple model that captures the grain size and microstructural defects in the solder. The mechanical behavior of the solder is incorporated into the model in the form of time-dependent viscoplastic equations derived from experimental creep tests. The unique aspect of this methodology is that the constants in the constitutive relations ... continued below

Physical Description

9 p.

Creation Information

Frear, D.R.; Burchett, S.N. & Neilsen, M.K. February 1, 1997.

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This report is part of the collection entitled: Office of Scientific & Technical Information Technical Reports and was provided by UNT Libraries Government Documents Department to Digital Library, a digital repository hosted by the UNT Libraries. More information about this report can be viewed below.

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  • Sandia National Laboratories
    Publisher Info: Sandia National Labs., Albuquerque, NM (United States)
    Place of Publication: Albuquerque, New Mexico

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Description

A microstructurally-based computational simulation is presented that predicts the behavior and lifetime of solder interconnects for electronic applications. This finite element simulation is based on an internal state variable constitutive model that captures both creep and plasticity, and accounts for microstructural evolution. The basis of the microstructural evolution is a simple model that captures the grain size and microstructural defects in the solder. The mechanical behavior of the solder is incorporated into the model in the form of time-dependent viscoplastic equations derived from experimental creep tests. The unique aspect of this methodology is that the constants in the constitutive relations of the model are determined from experimental tests. This paper presents the constitutive relations and the experimental means by which the constants in the equations are determined. The fatigue lifetime of the solder interconnects is predicted using a damage parameter (or grain size) that is an output of the computer simulation. This damage parameter methodology is discussed and experimentally validated.

Physical Description

9 p.

Notes

OSTI as DE97002647

Source

  • ASME international intersociety electronic and photonic packaging conference and exhibition, Honolulu, HI (United States), 15-19 Jun 1997

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  • Other: DE97002647
  • Report No.: SAND--97-0108C
  • Report No.: CONF-970616--2
  • Grant Number: AC04-94AL85000
  • DOI: 10.2172/486148 | External Link
  • Office of Scientific & Technical Information Report Number: 486148
  • Archival Resource Key: ark:/67531/metadc675408

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Office of Scientific & Technical Information Technical Reports

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Creation Date

  • February 1, 1997

Added to The UNT Digital Library

  • July 25, 2015, 2:21 a.m.

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  • April 13, 2016, 2:45 p.m.

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Frear, D.R.; Burchett, S.N. & Neilsen, M.K. Life prediction modeling of solder interconnects for electronic systems, report, February 1, 1997; Albuquerque, New Mexico. (digital.library.unt.edu/ark:/67531/metadc675408/: accessed December 14, 2017), University of North Texas Libraries, Digital Library, digital.library.unt.edu; crediting UNT Libraries Government Documents Department.