Microstructurally based finite element simulation of solder joint behavior

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Description

The most commonly used solder for electrical interconnects in electronic packages is the near eutectic 60Sn-40Pb alloy. This alloy has a number of processing advantages (suitable melting point of 183C and good wetting behavior). However, under conditions of cyclic strain and temperature (thermomechanical fatigue) the microstructure of this alloy undergoes a heterogeneous coarsening and failure process that makes the prediction of solder joint lifetime complex. A finite element simulation methodology to predict solder joint mechanical behavior, that includes microstructural evolution, has been developed. The mechanical constitutive behavior was incorporated into the time dependent internal state variable viscoplastic model through experimental ... continued below

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11 p.

Creation Information

Frear, D.R.; Burchett, S.N.; Neilsen, M.K. & Stephens, J.J. January 1, 1996.

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  • Sandia National Laboratories
    Publisher Info: Sandia National Labs., Albuquerque, NM (United States)
    Place of Publication: Albuquerque, New Mexico

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Description

The most commonly used solder for electrical interconnects in electronic packages is the near eutectic 60Sn-40Pb alloy. This alloy has a number of processing advantages (suitable melting point of 183C and good wetting behavior). However, under conditions of cyclic strain and temperature (thermomechanical fatigue) the microstructure of this alloy undergoes a heterogeneous coarsening and failure process that makes the prediction of solder joint lifetime complex. A finite element simulation methodology to predict solder joint mechanical behavior, that includes microstructural evolution, has been developed. The mechanical constitutive behavior was incorporated into the time dependent internal state variable viscoplastic model through experimental creep tests. The microstructural evolution is incorporated through a series of mathematical relations that describe mass flow in a temperature/strain environment. The model has been found to simulate observed thermomechanical fatigue behavior in solder joints.

Physical Description

11 p.

Notes

OSTI as DE96004647

Source

  • National Electronic Producers conference, Anaheim, CA (United States), 25-29 Feb 1996

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  • Other: DE96004647
  • Report No.: SAND--96-0056C
  • Report No.: CONF-960251--1
  • Grant Number: AC04-94AL85000
  • Office of Scientific & Technical Information Report Number: 197224
  • Archival Resource Key: ark:/67531/metadc672582

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Office of Scientific & Technical Information Technical Reports

Reports, articles and other documents harvested from the Office of Scientific and Technical Information.

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Creation Date

  • January 1, 1996

Added to The UNT Digital Library

  • June 29, 2015, 9:42 p.m.

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  • April 14, 2016, 5:48 p.m.

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Frear, D.R.; Burchett, S.N.; Neilsen, M.K. & Stephens, J.J. Microstructurally based finite element simulation of solder joint behavior, article, January 1, 1996; Albuquerque, New Mexico. (digital.library.unt.edu/ark:/67531/metadc672582/: accessed October 19, 2017), University of North Texas Libraries, Digital Library, digital.library.unt.edu; crediting UNT Libraries Government Documents Department.