Micro-machined heat pipes in silicon MCM substrates

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Description

Multichip modules (MCMs) containing power components need a substrate with excellent heat spreading capability both to avoid hot spots and to move dissipated heat toward the system heat sinks. Polycrystalline diamond is an excellent MCM heat spreading substrate but remains several orders of magnitude too expensive and somewhat more difficult to process than conventional mother-board materials. Today`s power MCMs concentrate on moderately priced silicon wafers and aluminum nitride ceramic with their improved thermal conductivity and good thermal expansion match to power semiconductor components, in comparison to traditional alumina and printed wiring board materials. However, even silicon and AlN substrates are ... continued below

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3 p.

Creation Information

Benson, D.A.; Mitchell, R.T.; Tuck, M.R.; Adkins, D.R. & Palmer, D.W. December 31, 1995.

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  • Sandia National Laboratories
    Publisher Info: Sandia National Labs., Albuquerque, NM (United States)
    Place of Publication: Albuquerque, New Mexico

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Description

Multichip modules (MCMs) containing power components need a substrate with excellent heat spreading capability both to avoid hot spots and to move dissipated heat toward the system heat sinks. Polycrystalline diamond is an excellent MCM heat spreading substrate but remains several orders of magnitude too expensive and somewhat more difficult to process than conventional mother-board materials. Today`s power MCMs concentrate on moderately priced silicon wafers and aluminum nitride ceramic with their improved thermal conductivity and good thermal expansion match to power semiconductor components, in comparison to traditional alumina and printed wiring board materials. However, even silicon and AlN substrates are challenged by designers` thermal needs. We report on the fabrication of micro-heat pipes embedded in silicon MCM substrates (5{times}5 cm) by the use of micromachined capillary wick structures and hermetic micro-cavities. This passive microstructure results in more than a 5 times improvement in heat spreading capability of the silicon MCM substrate over a large range of power densities and operating temperatures as compared with silicon alone. Thus diamond-like cooling is possible at silicon prices.

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3 p.

Notes

OSTI as DE96004314

Source

  • Multichip module conference, Santa Cruz, CA (United States), 6-7 Feb 1996

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  • Other: DE96004314
  • Report No.: SAND--95-3055C
  • Report No.: CONF-960250--1
  • Grant Number: AC04-94AL85000
  • Office of Scientific & Technical Information Report Number: 197226
  • Archival Resource Key: ark:/67531/metadc672068

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Office of Scientific & Technical Information Technical Reports

Reports, articles and other documents harvested from the Office of Scientific and Technical Information.

Office of Scientific and Technical Information (OSTI) is the Department of Energy (DOE) office that collects, preserves, and disseminates DOE-sponsored research and development (R&D) results that are the outcomes of R&D projects or other funded activities at DOE labs and facilities nationwide and grantees at universities and other institutions.

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  • December 31, 1995

Added to The UNT Digital Library

  • June 29, 2015, 9:42 p.m.

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  • April 13, 2016, 2:59 p.m.

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Benson, D.A.; Mitchell, R.T.; Tuck, M.R.; Adkins, D.R. & Palmer, D.W. Micro-machined heat pipes in silicon MCM substrates, article, December 31, 1995; Albuquerque, New Mexico. (digital.library.unt.edu/ark:/67531/metadc672068/: accessed October 22, 2017), University of North Texas Libraries, Digital Library, digital.library.unt.edu; crediting UNT Libraries Government Documents Department.