Low-power modular parallel photonic data links

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Description

Many of the potential applications for parallel photonic data links could benefit from a bi-directional Optoelectronic Multi-Chip Module (OEMCM), where the optical transmitter, receiver, and first-level interface electronics are combined into a single package. It would be desirable for such a module to exhibit low power consumption, have a simple electronic interface that can operate at a variety of speeds, and possess a capability to use interchangeable optics for a variety of external connections. Here, we describe initial results for a parallel photonic link technology that exhibits those properties. This link uses high-efficiency, back-emitting, two-dimensional Vertical Cavity Surface-Emitting Laser (VCSEL) ... continued below

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6 p.

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Carson, R.F.; Lovejoy, M.L.; Lear, K.L.; Warren, M.E.; Seigal, P.K.; Patrizi, G.A. et al. March 1, 1996.

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  • Sandia National Laboratories
    Publisher Info: Sandia National Labs., Albuquerque, NM (United States)
    Place of Publication: Albuquerque, New Mexico

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Description

Many of the potential applications for parallel photonic data links could benefit from a bi-directional Optoelectronic Multi-Chip Module (OEMCM), where the optical transmitter, receiver, and first-level interface electronics are combined into a single package. It would be desirable for such a module to exhibit low power consumption, have a simple electronic interface that can operate at a variety of speeds, and possess a capability to use interchangeable optics for a variety of external connections. Here, we describe initial results for a parallel photonic link technology that exhibits those properties. This link uses high-efficiency, back-emitting, two-dimensional Vertical Cavity Surface-Emitting Laser (VCSEL) arrays operating at 980 nm. The lasers are matched, via integrated microlenses, to corresponding monolithically-integrated photoreceiver arrays that are constructed in a InGaAs/InP Heterojunction Bipolar Transistor (HBT) technology. In initial breadboard-level tests, the photonic data channels built with these devices have been demonstrated with direct (3.3 V) CMOS drive of the VCSELs and a corresponding CMOS interface at the photoreceiver outputs. These links have shown electrical power consumption as low as 42 mW per channel for a 50% average duty cycle while operating at 100 Mb/s.

Physical Description

6 p.

Notes

OSTI as DE96006984

Source

  • IEEE electronic components and technology conference, Orlando, FL (United States), 28-31 May 1996

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  • Other: DE96006984
  • Report No.: SAND--95-2797C
  • Report No.: CONF-9605101--4
  • Grant Number: AC04-94AL85000
  • Office of Scientific & Technical Information Report Number: 228448
  • Archival Resource Key: ark:/67531/metadc671548

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Office of Scientific & Technical Information Technical Reports

Reports, articles and other documents harvested from the Office of Scientific and Technical Information.

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  • March 1, 1996

Added to The UNT Digital Library

  • June 29, 2015, 9:42 p.m.

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  • April 14, 2016, 4:16 p.m.

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Carson, R.F.; Lovejoy, M.L.; Lear, K.L.; Warren, M.E.; Seigal, P.K.; Patrizi, G.A. et al. Low-power modular parallel photonic data links, article, March 1, 1996; Albuquerque, New Mexico. (digital.library.unt.edu/ark:/67531/metadc671548/: accessed October 17, 2017), University of North Texas Libraries, Digital Library, digital.library.unt.edu; crediting UNT Libraries Government Documents Department.