Quantitative prediction of stresses during thermoset cure Metadata

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Title

  • Main Title Quantitative prediction of stresses during thermoset cure

Creator

  • Author: Adolf, D.
    Creator Type: Personal
  • Author: Chambers, B.
    Creator Type: Personal
  • Author: Burchett, S.
    Creator Type: Personal

Contributor

  • Sponsor: United States. Department of Energy.
    Contributor Type: Organization
    Contributor Info: USDOE, Washington, DC (United States)

Publisher

  • Name: Sandia National Laboratories
    Place of Publication: Albuquerque, New Mexico
    Additional Info: Sandia National Labs., Albuquerque, NM (United States)

Date

  • Creation: 1996-07-01

Language

  • English

Description

  • Content Description: Two thin-walled Al tubes were filled with epoxy which were cured isothermally; one tube was instrumented with strain gauges, and the other with thermocouples. Finite element codes were used. Predicted and measured centerline hoop strains are shown; predictions and measurements agree. This is being applied to encapsulated components.
  • Physical Description: 2 p.

Subject

  • Keyword: Stresses
  • STI Subject Categories: 36 Materials Science
  • Keyword: Resins
  • Keyword: Encapsulation
  • STI Subject Categories: 40 Chemistry
  • Keyword: Epoxides
  • Keyword: Curing

Source

  • Conference: 3. international conference on composites engineering, New Orleans, LA (United States), 21-26 Jul 1996

Collection

  • Name: Office of Scientific & Technical Information Technical Reports
    Code: OSTI

Institution

  • Name: UNT Libraries Government Documents Department
    Code: UNTGD

Resource Type

  • Article

Format

  • Text

Identifier

  • Other: DE96011718
  • Report No.: SAND--96-1589C
  • Report No.: CONF-960786--4
  • Grant Number: AC04-94AL85000
  • Office of Scientific & Technical Information Report Number: 253366
  • Archival Resource Key: ark:/67531/metadc670604

Note

  • Display Note: OSTI as DE96011718