Ultraminiature resonator accelerometer

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Description

A new family of microminiature sensors and clocks is being developed with widespread application potential for missile and weapons applications, as biomedical sensors, as vehicle status monitors, and as high-volume animal identification and health sensors. To satisfy fundamental technology development needs, a micromachined clock and an accelerometer have initially been undertaken as development projects. A thickness-mode quartz resonator housed in a micromachined silicon package is used as the frequency-modulated basic component of the sensor family. Resonator design philosophy follows trapped energy principles and temperature compensation methodology through crystal orientation control, with operation in the 20--100 MHz range, corresponding to quartz ... continued below

Physical Description

24 p.

Creation Information

Koehler, D.R.; Kravitz, S.H. & Vianco, P.T. April 1, 1996.

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  • Sandia National Laboratories
    Publisher Info: Sandia National Labs., Albuquerque, NM (United States)
    Place of Publication: Albuquerque, New Mexico

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Description

A new family of microminiature sensors and clocks is being developed with widespread application potential for missile and weapons applications, as biomedical sensors, as vehicle status monitors, and as high-volume animal identification and health sensors. To satisfy fundamental technology development needs, a micromachined clock and an accelerometer have initially been undertaken as development projects. A thickness-mode quartz resonator housed in a micromachined silicon package is used as the frequency-modulated basic component of the sensor family. Resonator design philosophy follows trapped energy principles and temperature compensation methodology through crystal orientation control, with operation in the 20--100 MHz range, corresponding to quartz wafer thicknesses in the 75--15 micron range. High-volume batch-processing manufacturing is utilized, with package and resonator assembly at the wafer level. Chemical etching of quartz, as well as micromachining of silicon, achieves the surface and volume mechanical features necessary to fashion the resonating element and the mating package. Integration of the associated oscillator and signal analysis circuitry into the silicon package is inherent to the realization of a size reduction requirement. A low temperature In and In/Sn bonding technology allows assembly of the dissimilar quartz and silicon materials, an otherwise challenging task. Unique design features include robust vibration and shock performance, capacitance sensing with micromachined diaphragms, circuit integration, capacitance-to-frequency transduction, and extremely small dimensioning. Accelerometer sensitivities were measured in the 1--3 ppm/g range for the milligram proof-mass structures employed in the prototypes evaluated to date.

Physical Description

24 p.

Notes

OSTI as DE96010913

Source

  • Other Information: PBD: Apr 1996

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Identifier

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  • Other: DE96010913
  • Report No.: SAND--96-0971
  • Grant Number: AC04-94AL85000
  • DOI: 10.2172/231652 | External Link
  • Office of Scientific & Technical Information Report Number: 231652
  • Archival Resource Key: ark:/67531/metadc670588

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Office of Scientific & Technical Information Technical Reports

Reports, articles and other documents harvested from the Office of Scientific and Technical Information.

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Creation Date

  • April 1, 1996

Added to The UNT Digital Library

  • June 29, 2015, 9:42 p.m.

Description Last Updated

  • April 14, 2016, 7:12 p.m.

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Koehler, D.R.; Kravitz, S.H. & Vianco, P.T. Ultraminiature resonator accelerometer, report, April 1, 1996; Albuquerque, New Mexico. (digital.library.unt.edu/ark:/67531/metadc670588/: accessed December 15, 2017), University of North Texas Libraries, Digital Library, digital.library.unt.edu; crediting UNT Libraries Government Documents Department.