A silicon microbench concept for optoelectronic packaging

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Description

Optoelectronics (o/e) is currently too expensive for widespread application. We believe that the packaging (or fiber pigtailing) process must be automated to realize a significant reduction in the cost of o.e packages. We are addressing issues of automating the fiber pigtailing process on silicon waferboards or microbenches. This paper focuses on reflowing solders for the attachment of o/e components. We have recently developed miniature polysilicon heaters which are integrated on silicon microbenches. These miniature heaters avoid the problem of raising the entire microbench to the solder melting point to attach components. Most importantly, these miniature heaters are completely compatible with ... continued below

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8 p.

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Pocha, M. D.; Strand, O. T. & Kerns, J. A. June 24, 1996.

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Description

Optoelectronics (o/e) is currently too expensive for widespread application. We believe that the packaging (or fiber pigtailing) process must be automated to realize a significant reduction in the cost of o.e packages. We are addressing issues of automating the fiber pigtailing process on silicon waferboards or microbenches. This paper focuses on reflowing solders for the attachment of o/e components. We have recently developed miniature polysilicon heaters which are integrated on silicon microbenches. These miniature heaters avoid the problem of raising the entire microbench to the solder melting point to attach components. Most importantly, these miniature heaters are completely compatible with automating the attachment process. Designing silicon microbenches with on-board heaters requires some care. The thermal properties of the microbench itself along with all coatings and any heatsinking materials must be understood. The heaters must operate in a current and voltage regime compatible with the overall characteristics of the o.e package. Inadvertently reflowing solder in unanticipated locations may occur unless the thermal behavior of the microbench thoroughly known. This paper describes the design and fabrication of our microbenches and an experimental and theoretical study on these silicon microbenches which gives a complete picture of their thermal behavior.

Physical Description

8 p.

Notes

OSTI as DE96012905

Source

  • Surface Mount International: advanced electronics manufacturing technologies, San Jose, CA (United States), 3-12 Sep 1996

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  • Other: DE96012905
  • Report No.: UCRL-JC--124368
  • Report No.: CONF-9609212--1
  • Grant Number: W-7405-ENG-48
  • Office of Scientific & Technical Information Report Number: 288975
  • Archival Resource Key: ark:/67531/metadc670503

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Office of Scientific & Technical Information Technical Reports

Reports, articles and other documents harvested from the Office of Scientific and Technical Information.

Office of Scientific and Technical Information (OSTI) is the Department of Energy (DOE) office that collects, preserves, and disseminates DOE-sponsored research and development (R&D) results that are the outcomes of R&D projects or other funded activities at DOE labs and facilities nationwide and grantees at universities and other institutions.

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  • June 24, 1996

Added to The UNT Digital Library

  • June 29, 2015, 9:42 p.m.

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  • Feb. 23, 2016, 3:34 p.m.

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Pocha, M. D.; Strand, O. T. & Kerns, J. A. A silicon microbench concept for optoelectronic packaging, article, June 24, 1996; California. (digital.library.unt.edu/ark:/67531/metadc670503/: accessed December 16, 2017), University of North Texas Libraries, Digital Library, digital.library.unt.edu; crediting UNT Libraries Government Documents Department.